Intel Core Duo T2700 LF80539GF0532MX User Manual
Product codes
LF80539GF0532MX
Thermal Specifications and Design Considerations
84
Datasheet
NOTES:
1.
1.
The TDP specification should be used to design the processor thermal solution. The TDP is
not the maximum theoretical power the processor can generate.
not the maximum theoretical power the processor can generate.
2.
Not 100% tested. These power specifications are determined by characterization of the
processor currents at higher temperatures and extrapolating the values for the
temperature indicated.
processor currents at higher temperatures and extrapolating the values for the
temperature indicated.
3.
As measured by the activation of the on-die Intel Thermal Monitor. The Intel Thermal
Monitor’s automatic mode is used to indicate that the maximum T
Monitor’s automatic mode is used to indicate that the maximum T
J
has been reached.
Refer to
for more details.
4.
The Intel Thermal Monitor automatic mode must be enabled for the processor to operate
within specification.
within specification.
Table 24.
Power Specifications for the Intel Core Solo Processor ULV (Ultra Low
Voltage)
Symbol
Processor
Number
Core Frequency
& Voltage
Thermal Design
Power
Unit
Notes
TDP
U1500
U1400
U1300
U1400
U1300
1.33 GHz and HFM V
CC
1.20 GHz and HFM
V
V
CC
1.06 GHz and LFM
V
CC
800 MHz and LFM V
CC
5.5
5.5
5.5
5.5
5.5
5
W
At 100°C
Notes 1, 4
Symbol
Parameter
Min
Typ
Max
Unit
Notes
P
AH,
P
SGNT
Auto Halt, Stop Grant Power
at HFM V
at HFM V
CC
at LFM V
CC
3.0
2.2
2.2
W
At 50°C
Note 2
P
SLP
Sleep Power
at HFM V
at HFM V
CC
at LFM V
CC
2.9
2.1
2.1
W
At 50°C
Note 2
P
DSLP
Deep Sleep Power
at HFM V
at HFM V
CC
at LFM V
CC
1.5
1.2
1.2
W
At 35°C
Note 2
P
DPRSLP
Deeper Sleep Power
0.7
W
At 35°C
Note 2
P
DC4
Intel® Enhanced Deeper Sleep Power
0.6
W
At 35°C
Note 2
T
J
Junction Temperature
0
100
°C
Notes 3, 4