Transcend TS256MSK64V3N-I User Manual
T
T
T
S
S
S
2
2
2
5
5
5
6
6
6
M
M
M
S
S
S
K
K
K
6
6
6
4
4
4
V
V
V
3
3
3
N
N
N
-
-
-
I
I
I
204PIN DDR3 1333 SO-DIMM
1Rank 2GB With 256Mx8 CL9
Transcend Information Inc.
1
Description
The TS256MSK64V3N-I is a 256M x 64bits DDR3-1333
1Rank SO-DIMM. The TS256MSK64V3N-I consists of
8pcs 256Mx8bits DDR3 SDRAMs FBGA packages and a
2048 bits serial EEPROM on a 204-pin printed circuit
board. The TS256MSK64V3N-I is a Dual In-Line Memory
Module and is intended for mounting into 204-pin edge
connector sockets.
Synchronous design allows precise cycle control with the
use of system clock. Data I/O transactions are possible
on both edges of DQS. Range of operation frequencies,
programmable latencies allow the same device to be
useful for a variety of high bandwidth, high performance
memory system applications.
Features
•
Operating Temperature : -40°C to +85°C
•
Gold plating of PCB gold finger is 30u
•
RoHS compliant products.
•
JEDEC standard 1.5V ± 0.075V Power supply
•
VDDQ=1.5V ± 0.075V
•
Clock Freq: 667MHZ for 1333Mb/s/Pin.
•
Programmable CAS Latency: 5, 6, 7, 8, 9
•
Programmable Additive Latency (Posted /CAS): 0,
CL-2 or CL-1 clock
•
Programmable /CAS Write Latency (CWL) =7
(DDR3-1333)
•
8 bit pre-fetch
Burst Length: 4, 8
•
Bi-directional Differential Data-Strobe
•
Internal calibration through ZQ pin
•
On Die Termination with ODT pin
•
Serial presence detect with EEPROM
•
Asynchronous reset
Placement
A
A
A
A
B
B
B
B
D
D
D
D
E
E
E
E
C
C
C
C
F
F
F
F
G
G
G
G
H
H
H
H
IIII
J
J
J
J
K
K
K
K
PCB: 09-2821