Intel i7-640M CN80617006936AA User Manual
Product codes
CN80617006936AA
Datasheet
55
Thermal Management
8
A thermal solution for an power sharing enabled system needs to ensure that the Tj limit is not
exceeded while operating under the two extreme power conditions between the processor core and
the integrated graphics and memory controller components.
exceeded while operating under the two extreme power conditions between the processor core and
the integrated graphics and memory controller components.
9
Projected range in advance of the measured product data. Measured values will be available after
silicon characterization.
silicon characterization.
10
For power sharing designs it is recommended to establish the full cooling capability within 10°C of
the T
the T
j,max
specifications. Some processors may have a different Tj max value, please refer to
Processor Spec Update for details.
11
In rare occasions the specified maximum power limits may be violated when the package is not at a
thermally constrained environment
thermally constrained environment
12
Tj, min =0 deg
13
While running intensive graphical and computational workloads simultaneously the concurrent
package power may exceed specified limits in exceptional occasions. Nevertheless, the individual
component powers are not to exceed the component TDPs specified.
package power may exceed specified limits in exceptional occasions. Nevertheless, the individual
component powers are not to exceed the component TDPs specified.
Note
Definition
Table 18.
Dual-Core SV Thermal Power Specifications
TDP
1,2,6,7
Frequency
Power Sharing Design Points
8
T
j,max
4,5,10,12
State
CPU Core
Int. Gfx
and
Memory
Controller
and
Memory
Controller
Package
Concurrent
Power
Concurrent
Power
3
CPU Core
Int. Gfx
CPU Core
Extreme
(W)
Extreme
(W)
6,7,11
Int. Gfx
Extreme
(W)
Extreme
(W)
6,7
MCP
Thermal
Power
Limit (W)
Thermal
Power
Limit (W)
CPU Core
Int. Gfx
and
Memory
Controller
HFM
25 W
12.5 W
35 W
2.40 GHz
up to
2.66 GHz
500 MHz
up to
766 MHz
Proc: 29
Int Gfx: 6
Int Gfx: 6
Proc: 15
Int Gfx: 20
Int Gfx: 20
35
105ºC
100ºC
LFM
20 W
12.5 W
32.5 W
1.2 GHz
N/A
N/A
N/A
N/A
Table 19.
Dual-Core LV Thermal Power Specifications
TDP
1,2,6,7
Frequency
Power Sharing Design Points
8
T
j,max
4,5,10,12
State
CPU Core
Int. GFX
& Memory
Controller
& Memory
Controller
Package
Concurrent
Power
Concurrent
Power
3,13
CPU Core
Int. Gfx.
Controller
CPU Core
Extreme
(W)
Extreme
(W)
6,7
Int. Gfx
Extreme
(W)
Extreme
(W)
6,7
MCP
Thermal
Power
Limit (W)
Thermal
Power
Limit (W)
CPU Core
Int. Gfx
and
Memory
Controller
HFM
18 W
9.5 W
25 W
2.00 GHz
up to
2.13 GHz
266 MHz
up to
566 MHz
Proc: 21
Int Gfx: 4
Int Gfx: 4
Proc: 12
Int Gfx:
13
Int Gfx:
13
25
105ºC
100ºC
LFM
13 W
9.5 W
22.5 W
1.2 GHz
N/A
N/A
N/A
N/A