Nokia 9110 Service Manual
PAMS
Technical Documentation
RAE–2
BS1
Page 5 – 18
Section 02/99
Internal Signals and Connections
Table 9. IR–transceiver (N300) signals
Pin
Line
Symbol
Parameter
Minimum
Nominal
Maximum
Unit / Notes
3
TXD
Transmit data from CPU
2.30V
2.80V
2.85V
0V
0.45V
4
RXD
Receive data to CPU
2.0V
2.8V
2.85V
0
0.8V
Table 10. Signals between PDA CPU and Flash memories
Name
Function
Min
Nom
Max
Unit
Description / Note
SA(21:1)
System address
2.30
2.80
2.85
VDC
High
0
0.4
VDC
Low
SD(15:0)
System data from CPU
2.30
2.8
2.85
VDC
High
0
0.4
VDC
Low
System data from memory
2.40
2.8
2.85
VDC
High
0
0.4
VDC
Low
ROMCS(2:0)
Chip selects for Flash memo-
i
2.30
2.80
2.85
VDC
High
ries
0
0.4
VDC
Low
FLSHWRx
Flash write signal
2.30
2.80
2.85
VDC
High
0
0.4
VDC
Low, write enabled
ROMRDx
Flash read signal
2.30
2.80
2.85
VDC
High
0
0.4
VDC
Low, read enabled
GPIO_CS1
Write protect for RFD memory
2.30
2.80
2.85
VDC
High
0
0.4
VDC
Low, powered down
GPIO_CS7
RFD Flash ready
2.0
2.80
2.85
VDC
High, ready
0
0.8
VDC
Low, busy
Table 11. Signals between PDA CPU and DRAM Memory
Name
Function
Min
Nom
Max
Unit
Description / Note
MA(11:0)
Memory address
2.30
2.80
2.85
VDC
High
0
0.4
VDC
Low
SD(15:0)
Memory data from CPU
2.30
2.8
2.85
VDC
High
0
0
0.4
VDC
Low
Memory data from memory
2.0
2.8
2.85
VDC
High
0
0
0.6
VDC
Low
RAS0
Row access strobe
2.30
2.80
2.85
VDC
High
0
0.4
VDC
Low
CAS(1:0)
Column access strobe
2.30
2.80
2.85
VDC
High
0
0.4
VDC
Low
MWEx
Memory write enable
2.30
2.80
2.85
VDC
High
0
0.4
VDC
Low, write enabled