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Nokia 9110 Service Manual

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Page of 46
PAMS
Technical Documentation
RAE–2
Baseband 
Page 2– 17
Original  02/99
Table 5.  Board to Board Connector (X190)     (continued)  
Description /
Note
Unit
Max
Typ
Min
Function
Name
I/O
Pin
45
I/O
MMC_CMD
Memory Card Command / Ad-
dress / Response, Bidirection-
al
0
0
0.45
VDC
Low, Data to the
card
al
2.3
2.8
2.85
VDC
High, Data to the
card, pulled up
with 10kohm resis-
tor to MMC_VSYS
in CMT module
0.34
VDC
Low, Data from the
card
2.1
VDC
High, Data from
the card, pulled up
with 10kohm resis-
tor to MMC_VSYS
in CMT module
259.3
kHz
Frequency
46
I
MMC_VSYS
Memory Card Power Supply
2.75
2.85
VDC
47
I/O
MMC_DATA
Memory Card Bidirectional
Data
0
0
0.45
VDC
Low, Data to the
card
2.3
2.8
2.85
VDC
High, Data to the
card, pulled up
with 10kohm resis-
tor to MMC_VSYS
in CMT module
0
0
0.34
VDC
Low, Data from the
card
2.1
VDC
High, Data from
the card, pulled up
with 10kohm resis-
tor to MMC_VSYS
in CMT module
8.294
MHz
Frequency
48
GND
Global Ground
49
I
MMC_CLK
Memory Card Clock
0
0
0.45
VDC
Low
2.3
2.8
2.85
VDC
High
0.2592
8.294
MHz
Frequency
50
GND
Global Ground
RF Coax cable connector
A small SMD coax cable connector is situated on the baseband side of
the BS8 module.  It comprises the RF output for the internal antenna.
Internal Signals and Connections
This section describes the internal electrical connections and interface
levels on the baseband part of the BS8 module.  The electrical interface
specifications are collected into tables that cover a connector or a defined
interface each.
Microphone
The internal microphone is connected to the PCB with spring contacts.
The microphone input level is specified in the table below.  The micro-