HP Compaq KB-9965 311059-051 User Manual

In addition to the DIMM configuration requirements for advanced ECC memory, observe the 
following DIMM configuration requirements when installing DIMMs for single-board 
mirrored memory: 

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Bank C mirrors bank A, and bank D mirrors bank B. Banks A and C must always be 
populated. 

DIMMs in the mirrored banks must be configured identically to the banks they are 
mirroring. Corresponding banks (for instance, bank A and bank C) must be populated 
with DIMMs of the same capacity. 

 

In addition to the DIMM configuration requirements for advanced ECC memory, observe the 
following DIMM configuration requirements when installing DIMMs for hot-plug mirrored 
memory: 

Two memory boards must be installed. 

Both memory boards must be configured identically. Corresponding banks (for instance, 
bank A on the memory board in slot 1 and bank A on the memory board in slot 2) must 
be populated with DIMMs of the same capacity. 

 

 

  Electrostatic discharge can damage electronic components. Make sure you are 

properly grounded before beginning any installation procedure. 

To remove a memory board: 

1.  If the server is not configured for hot-plug mirrored memory, you must power down the 

server. Refer to “Powering Down the Server” in this chapter. 

If the server is configured for hot-plug mirrored memory, skip to step 2. 

2.  Open the hot-plug door. Refer to “Opening the Hot-Plug Door” in this chapter. 

Hot-replacement procedure: Determine which memory board you want to remove by 
locating the memory board with an amber memory status LED and one or more amber 
DIMM status LEDs. The Ready to Hot Plug LED must be green, indicating that you can 
perform a hot-plug procedure. 

 

  If the Ready to Hot Plug LED is off on both boards, then you must power down the server 

before replacing DIMMs.