Epson S1F70000 User Manual
S1F76640 Series
2–42
EPSON
S1F70000 Series
Technical Manual
Chip External Shape
Figure 4-4 Pad Assignments
(x)
(y)
(t)
Chip size :
2.30mm
×
2.60mm
×
0.30mm
PAD aperture : 100
µ
m
×
100
µ
m
DIE number : F76640D0A0
Pad Center Coordinates
S1F7664D0A0
Pad
Pad Center Coordinates
No.
Name
X[
µ
m]
Y[
µ
m]
1
RV
–984.0
1096.0
2
V
REG
788.0
3
(TESTOUT)
580.0
4
TC1
390.0
5
TC2
96.0
6
P
OFF
–218.0
7
GND
–510.0
8
OSC1
–802.0
9
OSC2
–1094.0
10
V
DD
–1134.0
11
CAP1–
–892.0
12
CAP1+
–514.0
13
CAP2–
182.0
14
CAP2+
372.0
15
CAP3+
750.0
16
V
O
942.0
17
V
RI
1134.0
+
(0,0)
Y
X
2.30mm
2.60mm
CHIP EXTERNAL SHAPE AND PAD CENTER COORDINATES
984.0