Intel Pentium 4 672 HH80547PG1122MH User Manual

Product codes
HH80547PG1122MH
Page of 90
Intel
®
 Pentium
®
 4 Processor in the 423-pin Package
                                               
   
85
 
8.4
Thermal Specifications
This section describes the cooling requirements of the fan heatsink solution utilized by the boxed 
processor.
8.4.1
Boxed Processor Cooling Requirements
The boxed processor may be directly cooled with a fan heatsink. However, meeting the processor's 
temperature specification is also a function of the thermal design of the entire system, and 
ultimately the responsibility of the system integrator. The processor temperature specification is 
found in Chapter 6.0 of this document. The boxed processor fan heatsink is able to keep the 
processor temperature within the specifications (see Table 33) in chassis that provide good thermal 
management. For the boxed processor fan heatsink to operate properly, it is critical that the airflow 
provided to the fan heatsink is unimpeded. Airflow of the fan heatsink is into the center and out of 
the sides of the fan heatsink. Airspace is required around the fan to ensure that the airflow through 
the fan heatsink is not blocked. Blocking the airflow to the fan heatsink reduces the cooling 
efficiency and decreases fan life. Figure 33 and Figure 34 illustrate an acceptable airspace 
clearance for the fan heatsink. The air temperature entering the fan should be kept below 40°C. 
Again, meeting the processor's temperature specification is the responsibility of the system 
integrator. 
Figure 32. Acceptable System Board Power Header Placement 
Relative to Processor Socket