Nxp Semiconductors PIP3119-P User Manual

Page of 6
Philips Semiconductors
Product specification
 Logic level TOPFET
PIP3119-P 
 
 
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum Rating System (IEC 134)
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
V
DS
Continuous drain source voltage
1
-
50
V
I
D
Continuous drain current
V
IS
 = 5 V; T
mb 
=
 
25˚C
-
self -
A
limited
I
D
Continuous drain current
V
IS
 = 5 V; T
mb 
 
121˚C
-
20
A
I
I
Continuous input current
-5
5
mA
I
IRM
Repetitive peak input current
δ
 
 0.1, tp = 300 
µ
s
-50
50
mA
P
D
Total power dissipation
T
mb
 
 25˚C
-
90
W
T
stg
Storage temperature
-55
175
˚C
T
j
Continuous junction temperature
2
normal operation
-
150
˚C
T
sold
Lead temperature
during soldering
-
260
˚C
ESD LIMITING VALUE
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
V
C
Electrostatic discharge capacitor
Human body model;
-
2
kV
voltage
C = 250 pF; R = 1.5 k
Ω
OVERVOLTAGE CLAMPING LIMITING VALUES
At a drain source voltage above 50 V the power MOSFET is actively turned on to clamp overvoltage transients.
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
Inductive load turn-off
I
DM
 = 20 A; V
DD
 
 20 V
E
DSM
Non-repetitive clamping energy
T
mb
 
 25˚C
-
350
mJ
E
DRM
Repetitive clamping energy
T
mb
 
 95˚C; f = 250 Hz
-
45
mJ
OVERLOAD PROTECTION LIMITING VALUE
With an adequate protection supply provided via the input pin, TOPFET can protect itself from two types of overload
- overtemperature and short circuit load.
SYMBOL
PARAMETER
REQUIRED CONDITION
MIN.
MAX.
UNIT
V
DS
Drain source voltage
3
4 V 
 V
IS
 
 5.5 V
0
35
V
THERMAL CHARACTERISTIC
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Thermal resistance
R
th j-mb
Junction to mounting base
-
-
1.25
1.39
K/W
Prior to the onset of overvoltage clamping.  For voltages above this value, safe operation is limited by the overvoltage clamping energy.
A higher T
j
 is allowed as an overload condition but at the threshold T
j(TO)
 the over temperature trip operates to protect the switch.
All control logic and protection functions are disabled during conduction of the source drain diode.
May 2001
2
Rev 1.000