Navman 20 User Manual
LA000577C © 2006 Navman New Zealand. All rights reserved. Proprietary information and specifications subject to change without notice.
Pin
Jupiter 30
Jupiter 20
GPIO
Name and Description
GPIO
Standard &
XTrac name
DR function
24
13
reserved
6
GPIO (SDO)
not.connected
25
4
reserved
5
GPIO (SDI)
ADC DOut
26
–
WAKEUP.
push-to-fix wakeup (active on +ve edge)
7
GPIO (SCK)
ADC Clk
27
15
ANT_OC.
antenna open circuit sensor input (active
high)
15
ANT_OC
FWD/REV.
fwd/rev input
(low=forward,.
high=reverse)
28
1
ANT_CTRL.
active antenna control output
1
ANT_CTRL
WHEEL_TICKS.
wheel tick input
8
14
NANT_SC.
antenna short circuit sensor input (active
low)
3
NANT_SC
GYRO_IN.
gyro input
(analogue 0–5 V)
Table 2-2: Summary of pin multi-functionality
GPIO.
Note that the Jupiter 20 D (Dead Reckoning) does not support the active antenna supervisory
functionality and associated proprietary NMEA status messaging (see section 3.7).
SPI (Jupiter 20 only).
SPI (Jupiter 20 only).
The Jupiter 20 (GSW2) and Jupiter 20 S (XTrac) do not support the SPI. These pins function
only as user GPIOs.
The SPI on the Jupiter 20 D is used to control an internal ADC, which interfaces to an
The SPI on the Jupiter 20 D is used to control an internal ADC, which interfaces to an
external.gyro.
Implementation of the SPI for any other alternative function requires an SDK (Software
Implementation of the SPI for any other alternative function requires an SDK (Software
Development Kit) from SiRF.
2.2 Physical dimensions
The physical dimensions of the Jupiter 30 and Jupiter 20 modules are identical:
length: 25.4 mm ± 0.1 mm
width: 25.4 mm ± 0.1 mm
thickness: 3.0 mm max
weight: 4.0 g max
2.3 Manufacturing process recommendations
2.3.1 Reflow recommendations
For lead based solder pastes, the maximum reflow temperature is 225 °C for 10 seconds. For
For lead based solder pastes, the maximum reflow temperature is 225 °C for 10 seconds. For
lead-free solder pastes, the maximum reflow temperature is 265 °C for 10 seconds. Refer to
Figure 2-1.
Figure 2-1: Lead-free and tin/lead reflow profile recommendation
2.3.2 Connection pad material
The 30 surface mount connection pads have a base metal of copper with a gold flash finish.
The 30 surface mount connection pads have a base metal of copper with a gold flash finish.
This is suitable for a lead free manufacturing process.