Intel Pentium M 730 RH80536GE0252M User Manual

Product codes
RH80536GE0252M
Page of 97
 Thermal Specifications and Design Considerations
Mobile Intel
 Pentium
 4 Processor-M Datasheet  
89
6.
Thermal Specifications and Design 
Considerations
In order to achieve proper cooling of the processor, a thermal solution (e.g., heat spreader, heat 
pipe, or other heat transfer system) must make firm contact to the exposed processor die. The 
processor die must be clean before the thermal solution is attached or the processor may be 
damaged.    
 provides the Thermal Design Power (TDP) dissipation and the minimum and maximum 
T
J
 temperatures for the Mobile Intel Pentium 4 Processor-M. A thermal solution should be 
designed to ensure the junction temperature remains within the minimum and maximum T
J
 
specifications while operating at the Thermal Design Power. Additionally, a secondary failsafe 
mechanism in hardware would be provided to shutdown the processor under catastrophic thermal 
conditions, as described in 
. TDP is a thermal design power specification based on the 
worst case power dissipation of the processor while executing publicly available software under 
normal operating conditions at nominal voltages. Contact your Intel Field Sales Representative for 
further information.
Table 38.  Power Specifications for the Mobile Intel Pentium 4 Processor-M
NOTES:
1. TDP is defined as the worst case power dissipated by the processor while executing publicly available 
software under normal operating conditions at nominal voltages that meet the load line specifications. The 
TDP number shown is a specification based on I
CC
 (maximum) at nominal voltages and indirectly tested by 
this I
CC
 (maximum) testing. TDP definition is synonymous with the Thermal Design Power (typical) 
specification referred to in the previous EMTS. The Intel TDP specification is a recommended design point 
Symbol
Parameter
Min
Typ
Max
Unit
Notes
TDP
Thermal Design Power at
   2.6 GHz & 1.3 V
 
   2.5 GHz & 1.3 V
 
   2.4 GHz & 1.3 V
 
   2.2 GHz & 1.3 V
 
   2.0 GHz & 1.3 V
 
   1.9 GHz & 1.3 V
 
   1.8 GHz & 1.3 V
 
   1.7 GHz & 1.3 V
 
   1.6 GHz & 1.3 V
 
   1.5 GHz & 1.3 V
 
   1.4 GHz & 1.3 V
 
   1.2 GHz  &  1.2 V
35.0
35.0
35.0
35.0
32.0
32.0
30.0
30.0
30.0
26.9
25.8
20.8
W
At 100°C, Note 1
P
AH
 
P
SGNT
 
P
SLP
Auto Halt/Stop Grant/Sleep 
Power at
  1.3 V (for >2.0 GHz)
 
  1.3 V (for <= 2.0 GHz)
 
   1.2 V
8.0
7.5
5.9
W
At 50°C, Note 2
P
DSLP
Deep Sleep Power at
  1.3 V
 
  1.2 V
5.0
4.2
W
At 35°C, Note 2
P
DPRSLP
Deeper Sleep Power at
   1.0 V
2.9
W
At 35°C, Note 2
T
J
Junction Temperature
0
100
°C
Note 3