IBM Intel Xeon E5603 81Y6548 User Manual
Product codes
81Y6548
Boxed Processor Specifications
184
Intel
®
Xeon
®
Processor 5600 Series Datasheet Volume 1
9.3.1.1
STS100C (Passive / Active Combination Heat Sink Solution)
Active Configuration:
The active configuration of the combination solution is designed to help pedestal
chassis users to meet the thermal processor requirements without the use of chassis
ducting. It may be still be necessary to implement some form of chassis air guide or air
duct to meet the T
chassis users to meet the thermal processor requirements without the use of chassis
ducting. It may be still be necessary to implement some form of chassis air guide or air
duct to meet the T
LA
temperature of 40
C depending on the pedestal chassis layout.
Use of the active configuration in a 2U rackmount chassis is not recommended.
It is recommended that the ambient air temperature outside of the chassis be kept at
or below 35
or below 35
C. The air passing directly over the processor thermal solution should not
be preheated by other system components. Meeting the processor’s temperature
specification is the responsibility of the system integrator.
specification is the responsibility of the system integrator.
This thermal solution is for use with 95 W and 130 W TDP processor SKUs.
Passive Configuration:
In the passive configuration it is assumed that a chassis duct will be implemented.
Processors with a TDP of 130W or 95W must provide a minimum airflow of 30 CFM at
0.205 in. H
Processors with a TDP of 130W or 95W must provide a minimum airflow of 30 CFM at
0.205 in. H
2
O (51 m
3
/hr at 51.1 Pa) of flow impedance. For processors with a TDP of
130W it is assumed that a 40 °C T
LA
is met. This requires a superior chassis design to
limit the T
RISE
at or below 5°C with an external ambient temperature of 35°C. For
processors with a TDP of 95W it is assumed that a 55 °C T
LA
is met.
9.3.1.2
STS100A (Active Heat Sink Solution) (Pedestal only)
This active solution is designed to help pedestal chassis users to meet the thermal
processor requirements without the use of chassis ducting. It may be still be necessary
to implement some form of chassis air guide or air duct to meet the T
processor requirements without the use of chassis ducting. It may be still be necessary
to implement some form of chassis air guide or air duct to meet the T
LA
temperature of
40
C depending on the pedestal chassis layout. Use of this active solution in a 2U
rackmount chassis has not been validated.
It is recommended that the ambient air temperature outside of the chassis be kept at
or below 35
or below 35
C. The air passing directly over the processor thermal solution should not
be preheated by other system components. Meeting the processor’s temperature
specification is the responsibility of the system integrator.
specification is the responsibility of the system integrator.
This thermal solution is for use with processor SKUs no higher than 80 W.
9.3.1.3
STS100P (25.5 mm Tall Passive Heat Sink Solution) (Blade + 1U + 2U
Rack)
This passive solution is intended for use in SSI Blade, 1U or 2U rack configurations. It is
assumed that a chassis duct will be implemented in all configurations.
assumed that a chassis duct will be implemented in all configurations.
Processors with a TDP of 95 W must provide a minimum airflow of 16 CFM at 0.40 in.
H2O (27.2 m3/hr at 99.5 Pa) of flow impedance. It is assumed that a TLA of 49°C is
met for 95 W processor installations. This requires a chassis design to limit the TRISE
at or below 14°C with an external ambient temperature of 35°C. Under these
conditions, only Thermal Profile B will be supported. If Thermal Profile A support is
desired for processors with a TDP of 95 W a 2U configuration with a chassis duct is
recommended. A TLA of <40°C is required. This requires a superior chassis design to
limit the TRISE below 5°C with an external ambient temperature of 35°C.
H2O (27.2 m3/hr at 99.5 Pa) of flow impedance. It is assumed that a TLA of 49°C is
met for 95 W processor installations. This requires a chassis design to limit the TRISE
at or below 14°C with an external ambient temperature of 35°C. Under these
conditions, only Thermal Profile B will be supported. If Thermal Profile A support is
desired for processors with a TDP of 95 W a 2U configuration with a chassis duct is
recommended. A TLA of <40°C is required. This requires a superior chassis design to
limit the TRISE below 5°C with an external ambient temperature of 35°C.