IBM Intel Xeon E5606 81Y5943 User Manual
Product codes
81Y5943
Intel
®
Xeon
®
Processor 5600 Series Datasheet Volume 1
185
Boxed Processor Specifications
Processors with a TDP of 80 W or lower must provide a minimum airflow of 9.7 CFM at
0.20 in. H2O (16.5 m3/hr at 49.8 Pa) of flow impedance. It is assumed that a TLA of
49°C is met for these processor installations. This requires a chassis design to limit the
TRISE at or below 14°C with an external ambient temperature of 35°C.
0.20 in. H2O (16.5 m3/hr at 49.8 Pa) of flow impedance. It is assumed that a TLA of
49°C is met for these processor installations. This requires a chassis design to limit the
TRISE at or below 14°C with an external ambient temperature of 35°C.
Note:
lease refer to the Intel® Xeon® Processor 5500/5600 Series Thermal / Mechanical
Design Guidelines for detailed mechanical drawings of the STS100P.
9.4
Boxed Processor Contents
The Boxed Processor and Boxed Thermal Solution contents are outlined below.
Boxed Processor
• Intel® Xeon® processor 5600 series
processor
• Installation and warranty manual
• Intel Inside Logo
• Intel Inside Logo
Boxed Thermal Solution
• Heat sink assembly solution
• Thermal interface material (pre-applied on heat sink, if included)
• Installation and warranty manual
• Thermal interface material (pre-applied on heat sink, if included)
• Installation and warranty manual
§