IBM Intel Xeon E5606 81Y5943 User Manual

70

The package mechanical drawings are shown in 

Figure 4-2

 and 

. The 

drawings include dimensions necessary to design a thermal solution and reflect the 
processor as received by Intel. These dimensions include:

1. Package reference with tolerances (total height, length, width, and so forth)
2. IHS parallelism and tilt
3. Land dimensions
4. Top-side and back-side component keep-out dimensions
5. Reference datums
6. All drawing dimensions are in mm. 
7. Guidelines on potential IHS flatness variation with socket load plate actuation and 

installation of the cooling solution is available in the Intel

5500/5600 Series Thermal/Mechanical Design Guidelines.