IBM Intel Xeon E5606 49Y3776 User Manual
Product codes
49Y3776
Intel
®
Xeon
®
Processor 5600 Series Datasheet Volume 1
69
Package Mechanical Specifications
4
Package Mechanical
Specifications
4.1
Package Mechanical Specifications
The processor is packaged in a Flip-Chip Land Grid Array (FC-LGA) package that
interfaces with the baseboard via an LGA1366 socket. The package consists of a
processor mounted on a substrate land-carrier. An integrated heat spreader (IHS) is
attached to the package substrate and core and serves as the mating surface for
processor component thermal solutions, such as a heatsink.
interfaces with the baseboard via an LGA1366 socket. The package consists of a
processor mounted on a substrate land-carrier. An integrated heat spreader (IHS) is
attached to the package substrate and core and serves as the mating surface for
processor component thermal solutions, such as a heatsink.
shows a sketch
of the processor package components and how they are assembled together. Refer to
the Intel
the Intel
®
Xeon
®
Processor 5500/5600 Series Thermal/Mechanical Design Guidelines )
for complete details on the LGA1366 socket.
The package components shown in
1. Integrated Heat Spreader (IHS)
2. Thermal Interface Material (TIM)
3. Processor core (die)
4. Package substrate
5. Capacitors
2. Thermal Interface Material (TIM)
3. Processor core (die)
4. Package substrate
5. Capacitors
Note:
1.
Socket and baseboard are included for reference and are not part of processor package.
Figure 4-1. Processor Package Assembly Sketch
IHS
Substrate
LGA1366 Socket
System Board
Capacitors
TIM
IHS
Substrate
LGA
System Board
Capacitors
Die
TIM