RadioFrame Networks Inc MCSERIESHP10 User Manual

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MC-Series High-Power System 
 
System Definition 
998--01 Rev X1 
RadioFrame Networks, Inc. 
CONFIDENTIAL AND PROPRIETARY 19 
 
 
2.2  RadioFrame Networks Hardware 
RadioFrame Networks hardware receives layer-3 control messages (control, voice, 
packet data, SNMP, etc.) from the iSC and converts them into layer 2 PDUs (Protocol 
Data Units) that are sent every 15 ms (received every 7.5 ms). Then the AIC converts the 
layer-2 PDUs into raw layer-1 Baseband I/Q samples that are sent/received every 7.5 ms. 
Figure 3  MC-Series High Power System Functional Diagram 
 
2.2.1  Air/BTS Interface Chassis (ABIC) 
The BTS Interface Chassis (BIC) interfaces to the iSC and provides all Base Radio (BR) 
management functionality, including timing, converts iSC layer 3 messaging to layer 2 
packets, and converts 1PPS 5 MHz clock to packet-delivered timing. Within the BIC 
chassis are four assemblies (see the following illustrations): 
•  BIC Common RadioFrame Interface Card (CRIC) 
•  BTS Processing Card (BPC)—up to three BPCs per system, one BPC per sector, 
deployed in front slots 2, 3 and 4 
•  Ethernet Rear Transition Module (ERTM) 
•  Coax-to-RMII Transceiver Card (CRTC) (2) deployed in rear slots 3 and 5 
Figure 4  ABIC Front View 
 
Figure 5  ABIC Rear View, Showing Optional 2
nd
 CRTC in the Third Slot 
The Airlink Interface Chassis (AIC) provides layer-1 and layer-2 processing of call data, 
including routing of packet data to RadioBlade transceivers in RBS, as well as timing to 
the RBS. Within the AIC chassis are three assemblies:   
•  AIC Common RadioFrame Interface Card (CRIC) 
•  BTS Processing Card + Signal Processing Array Module (BPC+SPAM)—three 
BPC+SPAM per AIC in front slots 2, 3 and 4 
•  Ethernet Rear Transition Module (ERTM)