IBM Intel Xeon E5606 49Y3772 User Manual

11

The Intel

®

 Xeon

®

 processor 5600 series is a server/workstation multi-core processor 

based on 32 nm process technology. The processors feature two Intel

®

 QuickPath 

Interconnect point-to-point links capable of up to 6.4 GT/s, up to 12 MB of shared 
cache, and an Integrated Memory Controller. The processors are optimized for 
performance with the power efficiencies of a low-power microarchitecture to enable 
smaller, quieter systems.

This datasheet provides DC and AC electrical specifications, signal integrity, differential 
signaling specifications, pinout and signal definitions, package mechanical 
specifications and thermal requirements, and additional features pertinent to 
implementation and operation of the processor. 

The Intel Xeon processor 5600 series features a range of Thermal Design Power (TDP) 
envelopes from 40W TDP up to 130W TDP, and is segmented into multiple platforms:

• 2-Socket Frequency Optimized Server/Workstation Platforms support a 130 W 

Thermal Design Power (TDP) SKU and up to 6 core support. These platforms 
provide optimal overall performance and reliability, in addition to high-end graphics 
support.

• 2-Socket Advanced Server/Workstation Platforms support a 95 W Thermal Design 

Power (TDP) SKU. These platforms provide optimal overall performance featuring 
up to 6 core support.

• 2-Socket Standard Server/Workstation Platforms support 80 W TDP processor 

SKUs supporting up to 6 cores. These platforms provide optimal performance per 
watt for rack-optimized platforms.

• Low Power Platforms implement 60 W TDP (up to 6 cores) and 40 W TDP (up to 4 

cores) processor SKU’s. These processors are intended for dual-processor server 
blades and embedded servers.

• 1-Socket Workstation Platforms support Intel® Xeon® Processor W3680. These 

platforms enable a wide range of options for either the performance, power, or cost 
sensitive customer.

• Platforms supporting Higher Case Temperature Low-Voltage Processors with 60 W 

TDP (up to 6 cores) and 40 W TDP (up to 4 cores). The higher case temperatures 
are intended to meet the short-term thermal profile requirements of NEBS Level 3. 
These 2-socket processors are ideal for thermally-constrained form factors in 
embedded servers, communications and storage markets. 

Specifications denoted as 

LV-60W apply to the 

Intel® Xeon® Processor L5638.

 Specifications denoted as LV-40W 

apply to the 

Intel® Xeon® Processor L5618.

All references to “chipset” in this document pertain to the Intel

®

 5520 chipset and the 

Intel

®

 5500 chipset.

Intel is committed to delivering processors for both server and workstation platforms 
that maximize performance while meeting all Intel Quality and Reliability goals. The 
product’s reliability assessment is based on a datasheet compliant system and 
reference use condition. Intel utilizes a broad set of use condition assumptions (i.e. 
percentage of time in active vs. inactive operation, non-operating conditions, and the 
number of power cycles per year) to ensure proper operation over the life of the