IBM Intel Xeon E5620 49Y3773 User Manual

Product codes
49Y3773
Page of 186
Intel
®
 Xeon
®
 Processor 5600 Series Datasheet Volume 1
47
Electrical Specifications
2.7
Intel® QuickPath Interconnect Specifications
Intel
 QuickPath Interconnect specifications are defined at the processor 
pins. In most cases, termination resistors are not required as these are integrated into 
the processor silicon (Refer to 
).
Table 2-19. Common Intel® QuickPath Interconnect Specifications
Symbol
Parameter
Min
Nom
Max
Unit
Notes
UIavg
Avg UI size at “f” GT/s 
(f = 4.8, 5.86, or 6.4)
0.999 * 
Nom
1000/f
1.001 * 
Nom
psec
T
slew-rise-fall-pin
Defined as the slope of the rising or 
falling waveform as measured between 
+/- 100 mV of the differential transmitter 
output, for any data or clock.
10
25
V / nsec
Z
TX_LOW_CM_DC
DC resistance of Tx terminations at half 
the single ended swing (usually 
0.25*V
Tx-diff-pp-pin
) bias point
38
52
Z
TX_LOW_CM_DC
Defined as: (max(Z
TX_LOW_CM_DC
) - 
min(Z
TX_LOW_CM_DC
))
 
/ Z
TX_LOW_CM_DC 
expressed in %, over full range of Tx 
single ended voltage
-6
0
6
% of 
Z
TX_LOW_CM_DC
Z
RX_LOW_CM_DC
DC resistance of Rx terminations at half 
the single ended swing (usually 
0.25*V
Tx-diff-pp-pin
) bias point
38
52
Z
RX_LOW_CM_DC
Defined as: (max(Z
RX_LOW_CM_DC
) - 
min(Z
RX_LOW_CM_DC
))
 
/ Z
RX_LOW_CM_DC 
expressed in %, over full range of Rx 
single ended voltage
-6
0
6
% of 
Z
RX_LOW_CM_DC
N
MIN-UI-Validation
# of UI over which the eye mask voltage 
and timing spec needs to be validated
1,000,000
UI
Z
TX_HIGH_CM_DC
Single ended DC impedance to GND for 
either D+ or D- of any data bit at Tx
10k
1
Z
RX_HIGH_CM_DC
Single ended DC impedance to GND for 
either D+ or D- of any data bit at Rx
10k
2
Z
TX_LINK_DETECT
Link Detection Resistor
500
2000
V
TX_LINK_DETECT
Link Detection Resistor Pull-up Voltage
1.6
V
T
DATA_TERM_SKEW
Skew between first to last data 
termination meeting Z
RX_LOW_CM_DC
128
UI
T
INBAND_RESET_SENSE
Time taken by inband reset detector to 
sense Inband Reset
1.5
µs
T
CLK_DET
Time taken by clock detector to observe 
clock stability
20k
UI
T
CLK_FREQ_DET
Time taken by clock frequency detector 
to decide slow vs. operational clock after 
stable clock
32
Reference 
Clock Cycles
T
Refclk-Tx-Variability
Phase variability between Reference Clk 
(at Tx input) and Tx output
500
psec
T
Refclk-jitter-rms-onepll
Accumulated rms jitter over n UI of a 
given PLL model output in response to 
the jittery reference clock input. The PLL 
output is generated by convolving the 
measured reference clock phase jitter 
with a given PLL transfer function. Here 
n=12.
0.5
psec
BER
Lane
Bit Error Rate per lane valid for 4.8, 5.86 
and 6.4 GT/s
1.0E-14
Events
QPI[1,0]_COMP
COMP Resistance
21.0-1%
21.0
21.0+1%