Motorola Mobility LLC T56KT1 User Manual

Page of 116
Architecture Overview
10
 G30 - Module Hardware Description
December 15, 2009
The G30 consists of the following blocks:
Baseband
The baseband IC is combined with the RF transceiver and the power management unit (PMU).
This chipset provides all baseband and low power RF band functionality for GPRS/GSM, and 
includes:
Micro-controller Unit (MCU) for system and user code execution.
Digital Signal Processor (DSP) for voice and data processing.
Serial communications interfaces.
UART
SPI /I2S (via M2M Zone Platform)
SIM card 
I
2
C (via M2M Zone Platform)
Power Management IC (PMIC).
Internal regulators
External VRTC regulator
Voltage reference (applies for 70 pin connector interface model only)
Analog audio interface management.
Handset
Headset
Hands Free
General purpose and dedicated A/D signals.
A/D
Voltage sensor
Temperature sensor
Real Time Clock (RTC) subsystem.
RF transceiver.
The G30 base band system provides all necessary interfaces for hardware or software designing 
and debugging, which are available by means of the 81 board to board pads or the 70 pin 
connector interface.
RF Block
The G30 RF section is designed with minimum discrete parts, making it more reliable.
The RF block consists of:
RF Transceiver/Receiver block in the same single chip IC as the MCU
2 Rx Filters
RF power amplifier and Front End Module in single chip IC