Quintic Microelectronics Co. Ltd. 9321-0 User Manual
Rev1.4(4/23)
Confidential and Proprietary ©2012-2014 by Quintic Corporation, not for distribution.
Page 9 of 13
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Confidential Information contained herein is covered under Non-Disclosure Agreement (NDA).
Preliminary datasheet, Quintic Corporation reserves right to modify without notification
6 Soldering Recommendations
QS9321 is compatible with industrial standard reflow profile for Pb-free solders. The reflow profile used
is dependent on the thermal mass of the entire populated PCB, heat transfer efficiency of the oven and
particular type of solder paste used. Consult the datasheet of particular solder paste for profile
configurations.. Since the profile used is process and layout dependent, the optimum profile should be
studied case by case. Thus following recommendation should be taken as a starting point guide.
particular type of solder paste used. Consult the datasheet of particular solder paste for profile
configurations.. Since the profile used is process and layout dependent, the optimum profile should be
studied case by case. Thus following recommendation should be taken as a starting point guide.
- Refer to technical documentations of particular solder paste for profile configurations
- Avoid using more than one flow.
- Aperture size of the stencil should be 1:1 with the pad size.
- Avoid using more than one flow.
- Aperture size of the stencil should be 1:1 with the pad size.