SHENZHEN MINEW TECHNOLOGIES CO. LTD. MS50SFB User Manual
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Page 6
BT 5.0 Module MS50SFB Specification
5. Layout and Soldering Considerations
To make sure wireless performance is at its best condition, please layout the module on the
carrier board as below instructions.
5.1 Carrier board under the antenna area of the module like the picture;
5.2 Keep out enough area for the antenna area;
5.3 Reflow profiles are to be selected according to standard manufacturing process;
5.4 The soldering temperature should be less than 206℃;
5.5 The module should be placed far away other low frequency and digital circuits;
5.6 The MS50 series modules contain highly sensitive electronic circuitry and are Electrostatic
carrier board as below instructions.
5.1 Carrier board under the antenna area of the module like the picture;
5.2 Keep out enough area for the antenna area;
5.3 Reflow profiles are to be selected according to standard manufacturing process;
5.4 The soldering temperature should be less than 206℃;
5.5 The module should be placed far away other low frequency and digital circuits;
5.6 The MS50 series modules contain highly sensitive electronic circuitry and are Electrostatic
Sensitive Devices (ESD). Handling the MS50 series modules without proper ESD protection
may destroy or damage them permanently.
may destroy or damage them permanently.
Recommended Layout for the Carrier Board
*PCB: It
’s the mother board / carrier board.
6. UART Commands
Please refer to the UART commands document to know more.
7. Package
Details
Tray
Carton
Quantity (module)
80 pcs
4000 pcs / 50 trays
Net Weight
40.0g
4.5Kg
Gross Weight
75.0g
9.5Kg
Size
20 x 18 x 5 cm
32 x 23 x 40 cm