SHENZHEN MINEW TECHNOLOGIES CO. LTD. MS88SF2 User Manual
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Page 5
BT 5.0 Module MS88SF2 Specification
3. Physical Dimension
Unit: mm
4. Layout and Soldering Considerations
To make sure wireless performance is at its best condition, please layout the module on the carrier board
as below instructions.
4.1 Carrier board under the antenna area of the module like the picture;
4.2 Keep out enough area for the antenna area;
4.3 Reflow profiles are to be selected according to standard manufacturing process;
4.4 The soldering temperature should be less than 206℃;
4.5 The module should be placed far away other low frequency and digital circuits;
4.6 The MS50 series modules contain highly sensitive electronic circuitry and are Electrostatic Sensitive
as below instructions.
4.1 Carrier board under the antenna area of the module like the picture;
4.2 Keep out enough area for the antenna area;
4.3 Reflow profiles are to be selected according to standard manufacturing process;
4.4 The soldering temperature should be less than 206℃;
4.5 The module should be placed far away other low frequency and digital circuits;
4.6 The MS50 series modules contain highly sensitive electronic circuitry and are Electrostatic Sensitive
Devices (ESD). Handling the MS88 series modules without proper ESD protection may destroy or
damage them permanently.
damage them permanently.
Recommended Layout for the Carrier Board
*PCB: It’s the mother board / carrier board.
Unit: mm