SolidRun Ltd MX6 User Manual
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SR-uSOM-MX6 Mechanical Description
Following is a diagram of the TOP VIEW of the SR-uSOM-MX6.
Notice the following details:
The carrier board must use the same footprint as in the above mechanical footprint.
J5002 is the main board to board header (bottom side in the diagram).
J8004 is the second board to board header (upper side in the diagram).
J5001 is the third board to board header (right side in the diagram).
CuBox-i design does not use the mechanical holes, since the mating strength of two
Hirose DF40 pairs and the internal heat spreader is satisfactory for the design
requirements.
Hirose DF40 pairs and the internal heat spreader is satisfactory for the design
requirements.
In case 1.5mm mating height was chosen, then the SR-uSOM-MX6 requirement
would be that all area beneath it on the carrier will be all dedicated ONLY for the
board to board connectivity; no other components are allowed.
In case higher mating is chosen, then 1.5mm should be reserved for the SR-uSOM-
MX6. For instance, if 3.5mm mating height is chosen, then 1.5mm is dedicated to
the MicroSOM print side components and the remaining 2mm for the carrier
components underneath the MicroSOM.
would be that all area beneath it on the carrier will be all dedicated ONLY for the
board to board connectivity; no other components are allowed.
In case higher mating is chosen, then 1.5mm should be reserved for the SR-uSOM-
MX6. For instance, if 3.5mm mating height is chosen, then 1.5mm is dedicated to
the MicroSOM print side components and the remaining 2mm for the carrier
components underneath the MicroSOM.
Refer to SolidRun HummingBoard and CuBox-i design and layout, where there are
examples of the main and second 80 pin header board to board usage.
examples of the main and second 80 pin header board to board usage.