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Avnet Inc
AVTEG001
User Manual
Avnet Inc AVTEG001 User Manual
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AES-BCM4343W-M1-G Datasheet
802.11 b/g/n WLAN, Bluetooth & BLE SoC Module
1 Table of Contents
2
Table of Figures .................................................................................................... 5
3
Functional Overview.............................................................................................. 6
3.1
Microcontroller .......................................................................................................... 6
3.2
SPI Flash Memory .................................................................................................... 6
3.3
WLAN ...................................................................................................................... 7
3.4
Bluetooth .................................................................................................................. 7
3.5
Antennas .................................................................................................................. 7
4
Block Diagram ....................................................................................................... 8
5
Module Pin Descriptions ....................................................................................... 9
5.1
Pin Descriptions ....................................................................................................... 9
5.2
Pin Definitions ........................................................................................................ 10
6
Electrical Specifications ...................................................................................... 11
6.1
Absolute Maximum Ratings .................................................................................... 11
6.2
Recommended Operating Conditions ..................................................................... 11
6.3
Power Supply Requirements .................................................................................. 11
6.4
WLAN Power Consumption .................................................................................... 12
6.5
Bluetooth Power Consumption ............................................................................... 12
6.6
Bluetooth Low Energy Power Consumption ........................................................... 12
6.7
Low Power Modes Power Consumption ................................................................. 12
7
RF Specifications ................................................................................................ 13
7.1
WLAN RF Characteristics....................................................................................... 13
7.1.1
Transmitter Specification ....................................................................................................14
7.1.2
Receiver Specification ........................................................................................................15
7.2
Bluetooth RF Characteristics .................................................................................. 17
7.2.1
Transmitter Specification ....................................................................................................17
7.2.2
Receiver Specification ........................................................................................................17
7.3
BLE RF Characteristics .......................................................................................... 18
8
Mechanical Specifications ................................................................................... 19
8.1
Mechanical Size ..................................................................................................... 19
8.2
Module PCB Footprint ............................................................................................ 20
8.3
Module Pad Size .................................................................................................... 20
8.4
Recommended Solder Paste Mask ........................................................................ 21
8.5
Recommended Solder Mask .................................................................................. 21
8.6
Tape and Reel Packaging ...................................................................................... 22
9
Soldering and Cleaning Recommendations ........................................................ 23
9.1
Optimum Soldering Reflow Profile .......................................................................... 23
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