AMD Sempron™ Processor-In-a-Box 3000+ SDA3000BOX User Manual
Product codes
SDA3000BOX
Chapter 7
Electrical Data
35
31993A-1 September 2004
AMD Sempron™ Processor Model 10 Data Sheet
AMD Preliminary Information
7.12
Thermal Diode Characteristics
The AMD Sempron processor model 10 provides a diode that
can be used in conjunction with an external temperature sensor
to determine the die temperature of the processor. The diode
anode (THERMDA) and cathode (THERMDC) are available as
pins on the processor, as described in “THERMDA and
THERMDC Pins” on page 73.
can be used in conjunction with an external temperature sensor
to determine the die temperature of the processor. The diode
anode (THERMDA) and cathode (THERMDC) are available as
pins on the processor, as described in “THERMDA and
THERMDC Pins” on page 73.
For information about thermal design for the AMD Sempron
p r o c e s s o r m o d e l 1 0 , i n c l u d i n g l ay o u t a n d a i r f l o w
considerations, see the AMD Processor Thermal, Mechanical, and
Chassis Cooling Design Guide, order# 23794, and the cooling
guidelines on http://www.amd.com.
p r o c e s s o r m o d e l 1 0 , i n c l u d i n g l ay o u t a n d a i r f l o w
considerations, see the AMD Processor Thermal, Mechanical, and
Chassis Cooling Design Guide, order# 23794, and the cooling
guidelines on http://www.amd.com.
Thermal Diode
Electrical
Characteristics
Electrical
Characteristics
Table 13 shows the AMD Sempron processor model 10 charac-
teristics of the on-die thermal diode. For information about cal-
culations for the ideal diode equation and temperature offset
correction, see Appendix A, "Thermal Diode Calculations," on
page 77.
teristics of the on-die thermal diode. For information about cal-
culations for the ideal diode equation and temperature offset
correction, see Appendix A, "Thermal Diode Calculations," on
page 77.
Thermal Protection
Characterization
Characterization
The following section describes parameters relating to thermal
protection. The implementation of thermal control circuitry to
control processor temperature is left to the manufacturer to
determine how to implement.
protection. The implementation of thermal control circuitry to
control processor temperature is left to the manufacturer to
determine how to implement.
Table 13. Thermal Diode Electrical Characteristics
Symbol
Parameter
Description
Min
Nom
Max
Units
Notes
I
Sourcing current
5
300
µA
1
n
f, lumped
Lumped ideality
factor
factor
1.00000
1.00374
1.00900
2, 3, 4
n
f, actual
Actual ideality factor
1.00261
3, 4
R
T
Series Resistance
0.93
Ω
3, 4
Notes:
1. The sourcing current should always be used in forward bias only.
2. Characterized at 95°C with a forward bias current pair of 10
2. Characterized at 95°C with a forward bias current pair of 10
µA and 100 µA. AMD
recommends using a minimum of two sourcing currents to accurately measure the
temperature of the thermal diode.
temperature of the thermal diode.
3. Not 100% tested. Specified by design and limited characterization.
4. The lumped ideality factor adds the effect of the series resistance term to the actual ideality
4. The lumped ideality factor adds the effect of the series resistance term to the actual ideality
factor. The series resistance term indicates the resistance from the pins of the processor to the
on-die thermal diode. The value of the lumped ideality factor depends on the sourcing current
pair used.
on-die thermal diode. The value of the lumped ideality factor depends on the sourcing current
pair used.