AMD Sempron 3300 box S754 SDA3300BABOX User Manual
Product codes
SDA3300BABOX
Chapter 6
333 FSB AMD Sempron™ Processor Model 10 Specifications
21
31993A-1 September 2004
AMD Sempron™ Processor Model 10 Data Sheet
AMD Preliminary Information
6
333 FSB AMD Sempron™ Processor Model 10
Specifications
Specifications
This chapter describes the electrical specifications that are
u n i q u e t o t h e a dv a n c e d 3 3 3 f r o n t - s i d e b u s ( F S B )
AMD Sempron™ Processor Model 10.
u n i q u e t o t h e a dv a n c e d 3 3 3 f r o n t - s i d e b u s ( F S B )
AMD Sempron™ Processor Model 10.
6.1
Electrical and Thermal Specifications for the 333 FSB
AMD Sempron™ Processor Model 10
AMD Sempron™ Processor Model 10
Table 1 shows the electrical and thermal specifications in the
C0 working state and the S1 Stop Grant state for this processor.
C0 working state and the S1 Stop Grant state for this processor.
Table 1.
Electrical and Thermal Specifications for the Advanced 333 FSB AMD Sempron™ Processor
Model 10
Model 10
Frequency in MHz
(Model Number)
V
CC_CORE
(Core
Voltage)
I
CC
(Processor Current)
Thermal Power
5
Maximum Die
Temperature
Working State C0
Stop Grant S1
1, 2, 3, 4
Maximum Typical
Maximum
Typical Maximum Typical
2000 (3000+)
1.60 V
38.75 A
30.9 A
8.10 A
4.94 A
62.0 W
49.4 W
90°C
Notes:
2. The maximum Stop Grant currents are absolute worst case currents for parts that may yield from the worst case corner of the
process and are not representative of the typical Stop Grant current that is currently about one-third of the maximum specified
current.
3. These currents occur when the AMD Athlon™ system bus is disconnected and has a low power ratio of 1/8 for Stop Grant
disconnect and a low power ratio of 1/8 Halt disconnect applied to the core clock grid of the processor as dictated by a value of
2003_1223h programmed into the Clock Control (CLK_Ctl) MSR. For more information, refer to the AMD
Athlon™ and
AMD Duron™ Processors BIOS, Software, and Debug Developers Guide, order# 21656.
4. The Stop Grant current consumption is characterized at 50°C and not tested.
5. Thermal design power represents the maximum sustained power dissipated while executing publicly-available software or
instruction sequences under normal system operation at nominal V
CC_CORE
. Thermal solutions must monitor the temperature of
the processor to prevent the processor from exceeding its maximum die temperature.