Intel i5-2510E FF8062700853304 User Manual

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Datasheet

default register value after reset of the processor. Altering this MSR value may result in 

unpredictable behavior.

When designing a thermal solution for Intel Turbo Boost Technology and/or Graphics 

Dynamic Frequency enabled processor:

• Both component TDPs as well as extreme thermal power levels for the processor 

core and integrated graphics and memory controller must be considered. 

• Note that the processor can consume close to its maximum thermal power limit 

more frequently, and for prolonged periods of time.

• One must ensure that the component T

j,max

 limits are not exceeded when either 

component is operating at its extreme thermal power limit.

There are two “extreme” design points: 

• The processor core operating at maximum thermal power level (which is greater 

than its component TDP) and the integrated graphics and memory controller 

operating at its minimum thermal power.

• The integrated graphics operates at its maximum thermal power level, while the 

processor core consumes the remaining thermal power budget.

In both cases, the combined component thermal power will not exceed the total MCP 

package power limit. The design approach accommodating two extreme power levels is 

referred to as a “two-point” design. 

The following notes apply to 

.

1

The component TDPs given are not the maximum power the components can generate. Analysis 
indicates that real applications are unlikely to cause the processor to consume the theoretical 
maximum power dissipation for sustained periods of time.

2

A range of power is to be expected among the components due to the natural variation in the 
manufacturing process. Nevertheless, the individual component powers are not to exceed the 
component TDPs specified.

3

Concurrent package power refers to the actual power consumed by the package while TDP 
applications are running simultaneously by the processor core and the integrated graphics 
controller. An example of this could be the processor core running a Prime95* application, and the 
integrated graphics core running a Star Wars: Jedi Knight* menu simultaneously.

4

The thermal solution needs to ensure that the temperatures of both components do not exceed the 
maximum junction temperature (T

j,max

) limit, as measured by the DTS and the critical temperature 

bit.

5

Processor core and integrated graphics and memory controller junction temperatures are monitored 
by their respective DTS. A DTS outputs a temperature relative to the maximum supported junction 
temperature. The error associated with DTS measurements will not exceed ±5°C within the 
operating range.

6

The power supply to the processor core and the integrated graphics /Memory core should be 
designed as per Intel’s guidelines.

7

Processor core currents is monitored by IMON VR feedback (ISENSE) and calculated using a moving 
average method. Error associated with power monitoring will depend upon individual VR design.