Intel i5-2510E FF8062700853304 User Manual
Product codes
FF8062700853304
Datasheet
93
Electrical Specifications
NOTES:
1.
1.
Refers to a component device that is not assembled in a board or socket and is not electrically connected to
a voltage reference or I/O signal.
a voltage reference or I/O signal.
2.
Specified temperatures are not to exceed values based on data collected. Exceptions for surface mount
reflow are specified by the applicable JEDEC standard. Non-adherence may affect processor reliability.
reflow are specified by the applicable JEDEC standard. Non-adherence may affect processor reliability.
3.
T
absolute storage
applies to the unassembled component only and does not apply to the shipping media,
moisture barrier bags, or desiccant.
4.
Component product device storage temperature qualification methods may follow JESD22-A119 (low
temp) and JESD22-A103 (high temp) standards when applicable for volatile memory.
temp) and JESD22-A103 (high temp) standards when applicable for volatile memory.
5.
Intel® branded products are specified and certified to meet the following temperature and humidity limits
that are given as an example only (Non-Operating Temperature Limit: -40°C to 70°C and Humidity: 50%
to 90%, non-condensing with a maximum wet bulb of 28°C.) Post board attach storage temperature limits
are not specified for non-Intel branded boards.
that are given as an example only (Non-Operating Temperature Limit: -40°C to 70°C and Humidity: 50%
to 90%, non-condensing with a maximum wet bulb of 28°C.) Post board attach storage temperature limits
are not specified for non-Intel branded boards.
6.
The JEDEC J-JSTD-020 moisture level rating and associated handling practices apply to all moisture
sensitive devices removed from the moisture barrier bag.
sensitive devices removed from the moisture barrier bag.
7.
Nominal temperature and humidity conditions and durations are given and tested within the constraints
imposed by T
imposed by T
sustained storage
and customer shelf life in applicable Intel boxes and bags.
7.10
DC Specifications
The processor DC specifications in this section are defined at the processor
pins, unless noted otherwise. See
for the processor pin listings and
for signal definitions.
The DC specifications for the DDR3 signals are listed in
Control Sideband and
Test Access Port (TAP) are listed in
.
lists the DC specifications for the processor and are valid only while meeting
specifications for junction temperature, clock frequency, and input voltages. Care
should be taken to read all notes associated with each parameter.
Table 44.
Storage Condition Ratings
Symbol
Parameter
Min
Max
Notes
T
absolute storage
The non-operating device storage temperature.
Damage (latent or otherwise) may occur when
exceeded for any length of time.
Damage (latent or otherwise) may occur when
exceeded for any length of time.
-25°C
125°C
1, 2, 3, 4
T
sustained storage
The ambient storage temperature (in shipping
media) for a sustained period of time)
media) for a sustained period of time)
-5°C
40°C
5, 6
RH
sustained storage
The maximum device storage relative humidity
for a sustained period of time.
for a sustained period of time.
60% @ 24°C
6, 7
Time
sustained storage
A prolonged or extended period of time; typically
associated with customer shelf life.
associated with customer shelf life.
0 Months
6 Months
7