Intel i5-2520M FF8062700840017 User Manual

10

Datasheet

Intel® Core™ i7-600, i5-500, i5-400 and i3-300 Mobile Processor Series are the next 

generation of 64-bit, multi-core mobile processor built on 32-nanometer process 

technology. Based on the low-power/high-performance Nehalem micro-architecture, 

the processor is designed for a two-chip platform, as opposed to the traditional three-

chip platforms (processor, GMCH, and ICH). The two-chip platform consists of a 

processor and the Platform Controller Hub (PCH) and enables higher performance, 

lower cost, easier validation, and improved x-y footprint. The PCH may also be referred 

to as Mobile Intel® 5 Series Chipset. Intel Core i7-600, i5-500, i5-400 and i3-300 

Mobile Processor Series is designed for the Calpella platform and is offered in an 

rPGA988A or a BGA1288 package.

Included in this family of processors is an 

Intel® HD graphics

 and memory controller 

die on the same package as the processor core die. This two-chip solution of a 

processor core die with an I

ntel HD graphics 

and memory controller die is known as a 

multi-chip package (MCP) processor. 

Integrated graphics and memory controller die is built on 45-nanometer process 

technology.

Throughout this document, Intel Core i7-600, i5-500, i5-400 and i3-300 Mobile 

Processor Series may be referred to as simply the processor. 

Throughout this document, Intel HD Graphics may be referred to as simply integrated 

graphics.