Intel III 600 MHz 80526PY600256 User Manual
Product codes
80526PY600256
58
Datasheet
Pentium
®
III Processor for the PGA370 Socket at 500 MHz to 1.10 GHz
4.3
Thermal Diode
The Pentium
III
processor for the PGA370 socket incorporates an on-die diode that may be used to
monitor the die temperature (junction temperature). A thermal sensor located on the motherboard,
or a stand-alone measurement kit, may monitor the die temperature of the processor for thermal
management or instrumentation purposes.
or a stand-alone measurement kit, may monitor the die temperature of the processor for thermal
management or instrumentation purposes.
Table 33
and
Table 34
provide the diode parameter and
interface specifications. For more information please refer to the document, Intel
®
Pentium
®
III
Processor in the FC-PGA2 Package Thermal Design Guide.
Note:
The reading of the thermal sensor connected to the thermal diode will not necessarily reflect the
temperature of the hottest location on the die. This is due to inaccuracies in the thermal sensor, on-
die temperature gradients between the location of the thermal diode and the hottest location on the
die at a given point in time, and time based variations in the die temperature measurement. Time
based variations can occur when the sampling rate of the thermal diode (by the thermal sensor) is
slower than the rate at which the T
temperature of the hottest location on the die. This is due to inaccuracies in the thermal sensor, on-
die temperature gradients between the location of the thermal diode and the hottest location on the
die at a given point in time, and time based variations in the die temperature measurement. Time
based variations can occur when the sampling rate of the thermal diode (by the thermal sensor) is
slower than the rate at which the T
junction
temperature can change.
Figure 21. Processor Functional Die Layout for FC-PGA
Table 32. Processor Functional Die Layout for FC-PGA
CPUID
A: Die Area (cm
2
)
B: Core Area (cm
2
)
C: Cache Area (cm
2
)
0683H
1.046
0.726
0.320
0686H
0.900
0.642
0.258
068AH
0.947
0.642
0.305
A : D ie A rea
B: Core A rea (~63% of die area)
C: Cache A rea
Pin 1
Product Label