Intel III Xeon 800 MHz 80526KZ800256 User Manual
Product codes
80526KZ800256
BOXED PROCESSOR SPECIFICATIONS
85
E
F
Figure 35. Front View Space Requirements for the Boxed Processor
9.2.1 BOXED PROCESSOR HEATSINK DIMENSIONS
Table 53. Boxed Processor Heatsink Dimensions
Fig. Ref.
Label
Label
Dimensions (Inches)
Min
Typ
Max
A
Heatsink Depth (off heatsink attach point)
1.03
B
Heatsink Height (above baseboard)
0.485
C Heatsink
Base
Thickness
0.200
D
Heatsink Total Height at Fins
4.065
E
Heatsink Total Height at Base (see front view)
4.235
F
Heatsink Width (see front view)
5.05
9.2.2 BOXED PROCESSOR HEATSINK WEIGHT
The boxed processor heatsink will not weigh more than 350 grams (without auxiliary fan).
9.2.3 BOXED PROCESSOR RETENTION MECHANISM
The boxed Pentium® III Xeon™ processor at 700 MHz and 900 MHz requires a retention mechanism that
supports and secures the Single Edge Contact Cartridge (S.E.C.C.) in the 330-contact slot connector. An
S.E.C.C. retention mechanism is not provided with the boxed processor. Baseboards designed for use by
system integrators should include a retention mechanism and appropriate installation instructions. The boxed
The boxed Pentium® III Xeon™ processor at 700 MHz and 900 MHz requires a retention mechanism that
supports and secures the Single Edge Contact Cartridge (S.E.C.C.) in the 330-contact slot connector. An
S.E.C.C. retention mechanism is not provided with the boxed processor. Baseboards designed for use by
system integrators should include a retention mechanism and appropriate installation instructions. The boxed