Intel 200 MHz FV8050366200 User Manual
Product codes
FV8050366200
E
PENTIUM® PROCESSOR WITH MMX™ TECHNOLOGY
43
5/23/97 10:47 AM 24318502.DOC
INTEL CONFIDENTIAL
(until publication date)
Figure 11. 50 Percent V
CC
Measurement of Flight Time
4.0.
MECHANICAL SPECIFICATIONS
The Pentium processor with MMX technology is
packaged in 296-pin staggered pin grid array ceramic
(SPGA) or plastic (PPGA) packages. The pins are
arranged in a 37 x 37 matrix and the package
dimensions are 1.95" x 1.95" (Table 17). A 1.25" x
1.25" copper tungsten heat spreader may be
attached to the top of some of the ceramic packages.
This package design with spreader has been
replaced with a package which has no attached
packaged in 296-pin staggered pin grid array ceramic
(SPGA) or plastic (PPGA) packages. The pins are
arranged in a 37 x 37 matrix and the package
dimensions are 1.95" x 1.95" (Table 17). A 1.25" x
1.25" copper tungsten heat spreader may be
attached to the top of some of the ceramic packages.
This package design with spreader has been
replaced with a package which has no attached
spreader. In this section, both ceramic (spreader and
non-spreader) as well as plastic packages are
shown.
non-spreader) as well as plastic packages are
shown.
Package summary information is provided in
Table
Table
17. The mechanical specifications for the
Pentium processor with MMX technology are
provided in Table 18 and Table 19. Figure 12 and
Figure 13 show the package dimensions.
provided in Table 18 and Table 19. Figure 12 and
Figure 13 show the package dimensions.
Table 17. Package Information Summary for Pentium
®
Processor with MMX™ Technologty
Package Type
Total Pins
Pin Array
Package Size
Ceramic Staggered Pin Grid Array (SPGA)
296
37 x 37
1.95" x 1.95"
4.95 cm x 4.95 cm
Plastic Staggered Pin Grid Array (PPGA)
296
37 x 37
1.95" x 1.95"
4.95 cm x 4.95 cm