Intel 1.00 GHz YK80542KC0013M User Manual

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This chapter provides the mechanical specifications of the Itanium 2 processor.

The Itanium 2 processor package is comprised of an interposer, a processor package substrate, and 
an integrated heat spreader (IHS), as illustrated in 

. The interposer interfaces with the 

socket and the power pod and contains 611 pins which are positioned in a 25 x 28 grid. The IHS, 
which is mounted on the top surface of the processor package substrate, efficiently transfers the 
heat generated by the die to its surface.

 contains mechanical drawings and dimensions for the Itanium 2 processor package. 

 contains mechanical drawing for the power tab. All dimensions are measured in mm 

and are not to scale.

001160e

IHS

Interposer

Processor

Package

Substrate

(OLGA)