Intel III Xeon 500 MHz 80525KX5001M User Manual
Product codes
80525KX5001M
Pentium
®
III Xeon™ Processor at 500 and 550 MHz
52
Datasheet
5.2
Processor Thermal Analysis
5.2.1
Thermal Solution Performance
Processor cooling solutions should attach to the thermal plate. The processor cover is not designed
for thermal solution attachment.
for thermal solution attachment.
The complete thermal solution must adequately control the thermal plate and cover temperatures
below the maximum and above the minimum specified in
below the maximum and above the minimum specified in
. The performance of any
thermal solution is defined as the thermal resistance between the thermal plate and the ambient air
around the processor (
around the processor (
Θ
thermal plate to ambient
). The lower the thermal resistance between the thermal
plate and the ambient air, the more efficient the thermal solution is. The required
Θ
thermal plate to ambient
is dependent upon the maximum allowed thermal plate temperature
(T
PLATE
), the local ambient temperature (T
LA
) and the thermal plate power (P
PLATE
).
Θ
thermal plate to ambient
= (T
PLATE
– T
LA
)/P
PLATE
The maximum T
PLATE
. T
LA
is a function of the
system design.
provides the resultant thermal solution performance for a Pentium
III
Xeon
processor at maximum power dissipation allowable under FMB constraints for different ambient
air temperatures around the processor
air temperatures around the processor
The
Θ
thermal plate to ambient
value is made up of two primary components: the thermal resistance
between the thermal plate and heatsink (
Θ
thermal plate to heatsink
) and the thermal resistance between
the heatsink and ambient air around the processor (
Θ
heatsink to air
). A critical, but controllable factor
to decrease the resultant value of
Θ
thermal plate to heatsink
is management of the thermal interface
between the thermal plate and heatsink. The other controllable factor (
Θ
heatsink to air
) is determined
by the design of the heatsink and airflow around the heatsink. General Information on thermal
interfaces and heatsink design constraints can be found in AP-586, Pentium
interfaces and heatsink design constraints can be found in AP-586, Pentium
®
II Processor Thermal
Design Guidelines.
5.2.2
Thermal Plate to Heat Sink Interface Management Guide
shows suggested interface agent dispensing areas when using an Intel suggested interface
agent. Actual user area and interface agent selections will be determined by system issues in
meeting the T
meeting the T
PLATE
requirements.
Table 39. Example Thermal Solution Performance at Thermal Plate Power of 50 Watts
Thermal Solution Performance
Local Ambient Temperature (T
LA
)
Θ
thermal plate to ambient
35 °C
40 °C
45 °C
(°C/watt)
0.8
0.7
0.6