Intel III Xeon 500 MHz 80525KX5001M User Manual
Product codes
80525KX5001M
Pentium
®
III Xeon™ Processor at 500 and 550 MHz
74
Datasheet
system integrators should include a retention mechanism and appropriate installation instructions.
The boxed Pentium
The boxed Pentium
III
Xeon processor does not require additional heatsink supports. Heatsink
supports will not ship with the boxed Pentium
III
Xeon processor.
7.3
Thermal Specifications
This section describes the cooling requirements of the heatsink solution utilized by the boxed
processor.
processor.
7.3.1
Boxed Processor Cooling Requirements
The boxed processor passive heatsink requires airflow horizontally across the heatsink to cool the
processor. The boxed processor heatsink will keep the processor thermal plate temperature,
T
processor. The boxed processor heatsink will keep the processor thermal plate temperature,
T
PLATE
, within the specifications, provided adequate airflow is directed into the system chassis,
across the heatsink and out of the system chassis. System integrators should perform thermal
testing using thermocouples (see
testing using thermocouples (see
) to evaluate the thermal efficiency of the system.
Alternately, system integrators may use software to monitor the thermal information available via
the Processor Information ROM and thermal sensor (see
the Processor Information ROM and thermal sensor (see
) to evaluate the thermal
efficiency of the system.
7.3.2
Optional Auxiliary Fan Attachment
The boxed processor’s passive heatsink includes features that allow for attachment of a standard
40mm auxiliary fan (with 36mm mounting hole spacing) to improve airflow over the passive
heatsink. System integrators must evaluate the thermal performance of their system (see above) and
consider the baseboard manufacturer’s recommendations for thermal management before deciding
if an auxiliary fan is warranted. If an auxiliary fan is needed (e.g., for the front processor in a
multiprocessor system), it may be attached to the face of the boxed processor’s passive heatsink. To
facilitate this, the boxed processor’s passive heatsink includes features in the heatsink fins (see
40mm auxiliary fan (with 36mm mounting hole spacing) to improve airflow over the passive
heatsink. System integrators must evaluate the thermal performance of their system (see above) and
consider the baseboard manufacturer’s recommendations for thermal management before deciding
if an auxiliary fan is warranted. If an auxiliary fan is needed (e.g., for the front processor in a
multiprocessor system), it may be attached to the face of the boxed processor’s passive heatsink. To
facilitate this, the boxed processor’s passive heatsink includes features in the heatsink fins (see
) onto which fan mounting hardware (grommets and screws) can be
attached. Two grommets and four screws (two different lengths to accommodate different fan
thicknesses) are included with the boxed Pentium
thicknesses) are included with the boxed Pentium
III
Xeon processor. The boxed Pentium
III
Xeon
processor does not ship with an auxiliary fan. Specifications for the heatsink features are shown in