Intel E5-2407 BX80621E52407 User Manual

Product codes

BX80621E52407

Intel® Xeon® Processor E5-1600/ E5-2600/E5-4600 Product Families

Datasheet Volume One

3.2.4

Execute Disable Bit .................................................................................83

3.3

Intel® Hyper-Threading Technology.....................................................................83

3.4

Intel® Turbo Boost Technology ...........................................................................83
3.4.1

Intel® Turbo Boost Operating Frequency ...................................................83

3.5

Enhanced Intel SpeedStep® Technology...............................................................84

3.6

Intel® Intelligent Power Technology.....................................................................84

3.7

Intel® Advanced Vector Extensions (Intel® AVX) ..................................................84

3.8

Intel Dynamic Power Technology .........................................................................85

Power Management .................................................................................................87
4.1

ACPI States Supported .......................................................................................87
4.1.1

System States........................................................................................87

4.1.2

Processor Package and Core States ...........................................................87

4.1.3

Integrated Memory Controller States .........................................................88

4.1.4

DMI2/PCI Express* Link States.................................................................89

4.1.5

Intel QuickPath Interconnect States ..........................................................89

4.1.6

G, S, and C State Combinations................................................................90

4.2

Processor Core/Package Power Management .........................................................90
4.2.1

Enhanced Intel SpeedStep Technology.......................................................90

4.2.2

Low-Power Idle States.............................................................................91

4.2.3

Requesting Low-Power Idle States ............................................................92

4.2.4

Core C-states .........................................................................................92

4.2.5

Package C-States ...................................................................................94

4.2.6

Package C-State Power Specifications........................................................97

4.3

System Memory Power Management ....................................................................98
4.3.1

CKE Power-Down....................................................................................98

4.3.2

Self Refresh ...........................................................................................98

4.3.3

DRAM I/O Power Management ..................................................................99

4.4

DMI2/PCI Express* Power Management................................................................99

Thermal Management Specifications ...................................................................... 101
5.1

Package Thermal Specifications ......................................................................... 101
5.1.1

Thermal Specifications........................................................................... 101

5.1.2

TCASE and DTS Based Thermal Specifications........................................... 103

5.1.3

Processor Thermal Profiles ..................................................................... 104

5.1.4

Embedded Server Processor Thermal Profiles............................................ 130

5.1.5

Thermal Metrology ................................................................................ 133

5.2

Processor Core Thermal Features ....................................................................... 135
5.2.1

Processor Temperature.......................................................................... 135

5.2.2

Adaptive Thermal Monitor ...................................................................... 135

5.2.3

On-Demand Mode................................................................................. 137

5.2.4

PROCHOT_N Signal ............................................................................... 137

5.2.5

THERMTRIP_N Signal ............................................................................ 138

5.2.6

Integrated Memory Controller (IMC) Thermal Features............................... 138

Signal Descriptions ................................................................................................ 141
6.1

System Memory Interface Signals ...................................................................... 141

6.2

PCI Express* Based Interface Signals ................................................................. 142

6.3

DMI2/PCI Express* Port 0 Signals ...................................................................... 144

6.4

Intel QuickPath Interconnect Signals .................................................................. 144

6.5

PECI Signal..................................................................................................... 145

6.6

System Reference Clock Signals ........................................................................ 145

6.7

JTAG and TAP Signals....................................................................................... 145

6.8

Serial VID Interface (SVID) Signals .................................................................... 146

6.9

Processor Asynchronous Sideband and Miscellaneous Signals................................. 146

6.10 Processor Power and Ground Supplies ................................................................ 149