Intel III Xeon 550 MHz 80525KY5501M User Manual

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This section provides power dissipation specifications for each variation of the Pentium 

III

 Xeon 

processor. The thermal plate flatness is also specified for the S.E.C. cartridge. 

 provides the thermal design power dissipation for Pentium 

III

 Xeon processors. While the 

processor core dissipates the majority of the thermal power, the system designer should also be 
aware of the thermal power dissipated by the second level cache. Systems should design for the 
highest possible thermal power, even if a processor with lower frequency or smaller second level 
cache is planned. The thermal plate is the attach location for all thermal solutions. The maximum 
temperature for the entire thermal plate surface is shown in 

. 

The processor power is dissipated through the thermal plate and other paths. The power dissipation 
is a combination of power from the processor core, the second level cache and the AGTL+ bus 
termination resistors. The overall system thermal design must comprehend the total processor 
power. The combined power from the processor core and the second level cache that dissipates 
through the thermal plate is the thermal plate power. The heatsink should be designed to dissipate 
the thermal plate power. 

The thermal sensor feature of the processor cannot be used to measure T

PLATE

. The T

PLATE

 

specification must be met regardless of the reading of the processor's thermal sensor in order to 
ensure adequate cooling for the entire Pentium 

III

 Xeon processor.