Intel III 450 MHz 80525PY450512 Data Sheet

Product codes

80525PY450512

Datasheet

S.E.C.C. and S.E.C.C.2 Mechanical Specifications

5.0

S.E.C.C. and S.E.C.C.2 Mechanical Specifications

Pentium III processors use either S.E.C.C. or S.E.C.C.2 package technology. Both package types
contain the processor core, L2 cache, and other passive components. The cartridges connect to the
baseboard through an edge connector. Mechanical specifications for the processor are given in this
section. See

Section 1.1.1

for a complete terminology listing.

5.1

S.E.C.C. Mechanical Specifications

S.E.C.C. package drawings and dimension details are provided in

Figure 22

through

Figure 31

Figure 22

shows multiple views of the Pentium III processor in an S.E.C.C. package;

Figure 23

through

Figure 26

show the package dimensions;

Figure 27

an d

Figure 28

show the extended

thermal plate dimensions; and

Figure 29

and

Figure 30

provide details of the processor substrate

edge finger contacts.

Figure 31

and

Table 29

contain processor marking information. See

Section 5.2

for S.E.C.C.2 mechanical specifications.

The processor edge connector defined in this document is referred to as the “SC242 connector.”
See the Slot 1 Connector Specification (Document Number 243397) for further details on the
SC242 connector.

Note:

For

Figure 22

through

Figure 44

, the following apply:

1. Unless otherwise specified, the following drawings are dimensioned in inches.

2. All dimensions provided with tolerances are guaranteed to be met for all normal production

product.

3. Figures and drawings labeled as “Reference Dimensions” are provided for informational

purposes only. Reference Dimensions are extracted from the mechanical design database and
are nominal dimensions with no tolerance information applied. Reference Dimensions are
NOT checked as part of the processor manufacturing. Unless noted as such, dimensions in
parentheses without tolerances are Reference Dimensions.

4. Drawings are not to scale.

Figure 22. S.E.C.C. Packaged Processor — Multiple Views

Left

Right

Side

Left

Right

Thermal Plate

Side View

Cover Side view

Top View

Left Latch

Right Latch

Cover

Thermal

Plate