Intel III 450 MHz 80525PY450512 Data Sheet

Product codes

80525PY450512

Datasheet

S.E.C.C. and S.E.C.C.2 Mechanical Specifications

Figure 28. S.E.C.C. Packaged Processor — Extended Thermal Plate Attachment

Detail Dimensions, Continued

Figure 29. S.E.C.C. Packaged Processor Substrate — Edge Finger Contact Dimensions

v008

2.500

1.250

0.0032 / 1.000 x 1.000

.062

+.007

-.005

.045

70°

2.01 ±.008

2.992 ±.008

2.835

1.85

5.000

NOTE:

All dimensions without tolerance information are
considered reference dimensions only.

See Detail A in
Next Figure

Substrate

Cover

Thermal Plate

Pin A121

Pin A1

007.vsd