Intel S2600JFQ BBS2600JFQ User Manual
Product codes
BBS2600JFQ
Product Architecture Overview
Intel®
Server Board S2600JF TPS
Revision 1.3
Intel order number G31608-004
10
3.2 Processor Support
The server board includes two Socket-R (LGA 2011) processor sockets and can support one or
two of the Intel
two of the Intel
®
Xeon
®
processor E5-2600 product family, with a Thermal Design Power (TDP)
of up to 135W processor:
The Intel
®
Xeon™ E5-2600 processor family are composed of 6/8 cores respectively. The
microprocessors include an integrated DDR3 memory controller (IMC) with four memory
channels which can support up to three ECC Registered DIMMs or three Un-buffered ECC
DIMMs per memory channel, an integrated I/O controller with 40 PCI Express* Gen3 lanes
controlled by ten PCI Express* Master Controllers. The target TDPs are: 50W, 60W, 70W, 80W,
95W, 115W, 130W, and 135W on Intel
channels which can support up to three ECC Registered DIMMs or three Un-buffered ECC
DIMMs per memory channel, an integrated I/O controller with 40 PCI Express* Gen3 lanes
controlled by ten PCI Express* Master Controllers. The target TDPs are: 50W, 60W, 70W, 80W,
95W, 115W, 130W, and 135W on Intel
®
Server Board S2600JF.
Previous generation Intel
®
Xeon
®
processors are NOT supported on the Intel
®
server boards
described in this document.
For a complete updated list of supported processors, see:
On the Support
tab, look for “Compatibility” and then “Supported Processor List”
3.2.1
Processor Socket Assembly
Each processor socket of the server board is pre-assembled with an Independent Latching
Mechanism (ILM) and Back Plate which allow for secure placement of the processor and
processor heat to the server board.
Mechanism (ILM) and Back Plate which allow for secure placement of the processor and
processor heat to the server board.
The following illustration identifies each sub-assembly component:
Figure 6. Processor Socket Assembly