IBM Intel Xeon E5-2648L 95Y4670 User Manual
Product codes
95Y4670
Overview
20
Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families
Datasheet Volume One
• Memory thermal monitoring via MEM_HOT_C01_N and MEM_HOT_C23_N Signals
1.3.4
PCI Express
• L0s is not supported
• L1 ASPM power management capability
• L1 ASPM power management capability
1.3.5
Intel QuickPath Interconnect
• L0s is not supported
• L0p and L1 power management capabilities
• L0p and L1 power management capabilities
1.4
Thermal Management Support
• Digital Thermal Sensor with multiple on-die temperature zones
• Adaptive Thermal Monitor
• THERMTRIP_N and PROCHOT_N signal support
• On-Demand mode clock modulation
• Open and Closed Loop Thermal Throttling (OLTT/CLTT) support for system memory
• Adaptive Thermal Monitor
• THERMTRIP_N and PROCHOT_N signal support
• On-Demand mode clock modulation
• Open and Closed Loop Thermal Throttling (OLTT/CLTT) support for system memory
in addition to Hybrid OLTT/CLTT mode
• Fan speed control with DTS
• Two integrated SMBus masters for accessing thermal data from DIMMs
• New Memory Thermal Throttling features via MEM_HOT_C{01/23}_N signals
• Running Average Power Limit (RAPL), Processor and DRAM Thermal and Power
• Two integrated SMBus masters for accessing thermal data from DIMMs
• New Memory Thermal Throttling features via MEM_HOT_C{01/23}_N signals
• Running Average Power Limit (RAPL), Processor and DRAM Thermal and Power
Optimization Capabilities
1.5
Package Summary
The processor socket is a 52.5 x 45 mm FCLGA package (LGA2011-0 land FCLGA10).
1.6
Terminology
Term
Description
ASPM
Active State Power Management
BMC
Baseboard Management Controllers
Cbo
Cache and Core Box. It is a term used for internal logic providing ring interface to
LLC and Core.
DDR3
Third generation Double Data Rate SDRAM memory technology that is the
successor to DDR2 SDRAM
DMA
Direct Memory Access
DMI
Direct Media Interface
DMI2
Direct Media Interface Gen 2
DTS
Digital Thermal Sensor
ECC
Error Correction Code