Intel 4 515/515J JM80547PE0771M User Manual
Product codes
JM80547PE0771M
Datasheet
13
Introduction
•
Retention mechanism (RM)—Since the LGA775 socket does not include any mechanical
features for heatsink attach, a retention mechanism is required. Component thermal solutions
should attach to the processor via a retention mechanism that is independent of the socket.
features for heatsink attach, a retention mechanism is required. Component thermal solutions
should attach to the processor via a retention mechanism that is independent of the socket.
•
Storage conditions—Refers to a non-operational state. The processor may be installed in a
platform, in a tray, or loose. Processors may be sealed in packaging or exposed to free air.
Under these conditions, processor lands should not be connected to any supply voltages, have
any I/Os biased, or receive any clocks. Upon exposure to “free air” (i.e., unsealed packaging or
a device removed from packaging material) the processor must be handled in accordance with
moisture sensitivity labeling (MSL) as indicated on the packaging material.
platform, in a tray, or loose. Processors may be sealed in packaging or exposed to free air.
Under these conditions, processor lands should not be connected to any supply voltages, have
any I/Os biased, or receive any clocks. Upon exposure to “free air” (i.e., unsealed packaging or
a device removed from packaging material) the processor must be handled in accordance with
moisture sensitivity labeling (MSL) as indicated on the packaging material.
•
Functional operation—Refers to normal operating conditions in which all processor
specifications, including DC, AC, system bus, signal quality, mechanical and thermal, are
satisfied.
specifications, including DC, AC, system bus, signal quality, mechanical and thermal, are
satisfied.
1.2
References
Material and concepts available in the following documents may be beneficial when reading this
document.
document.
§
Table 1-1. References
Document
Document Numbers/
Location
Intel
®
Pentium
®
4 Processor on 90 nm Process Specification Update
http://developer.intel.com/
design/Pentium4/
specupdt/302352.htm
design/Pentium4/
specupdt/302352.htm
Intel
®
Pentium
®
4 Processor on 90 nm Process in the 775-Land Package
Thermal Design Guidelines
http://developer.intel.com/
design/Pentium4/guides/
302553.htm
design/Pentium4/guides/
302553.htm
Voltage Regulator Down (VRD) 10.1 Design Guide For Desktop LGA775 Socket
http://developer.intel.com/
design/Pentium4/guides/
302356.htm
design/Pentium4/guides/
302356.htm
Intel
®
Architecture Software Developer's Manual
http://developer.intel.com/
design/pentium4/
manuals/index_new.htm
design/pentium4/
manuals/index_new.htm
IA-32 Intel
®
Architecture Software Developer's Manual Volume 1: Basic
Architecture
IA-32 Intel
®
Architecture Software Developer's Manual Volume 2A: Instruction
Set Reference Manual A–M
IA-32 Intel
®
Architecture Software Developer's Manual Volume 2B: Instruction
Set Reference Manual, N–Z
IA-32 Intel
®
Architecture Software Developer's Manual Volume 3: System
Programming Guide
IA-32 Intel
®
Architecture and Intel® Extended Memory 64 Software
Developer's Manual Documentation Changes
http://developer.intel.com/
design/pentium4/
manuals/index_new.htm
design/pentium4/
manuals/index_new.htm