Intel 4 515/515J JM80547PE0771M User Manual

Product codes
JM80547PE0771M
Page of 96
 
Datasheet
35
Package Mechanical Specifications
3
Package Mechanical 
Specifications
The Pentium 4 processor in the 775-land package is packaged in a Flip-Chip Land Grid Array 
(FC-LGA4) package that interfaces with the motherboard via an LGA775 socket. The package 
consists of a processor core mounted on a substrate land-carrier. An integrated heat spreader (IHS) 
is attached to the package substrate and core and serves as the mating surface for processor 
component thermal solutions, such as a heatsink. 
 shows a sketch of the processor 
package components and how they are assembled together. Refer to the LGA775 Socket 
Mechanical Design Guide
 for complete details on the LGA775 socket.
The package components shown in 
 include the following:
Integrated Heat Spreader (IHS)
Thermal Interface Material (TIM)
Processor core (die)
Package substrate
Capacitors
NOTE:
1. Socket and motherboard are included for reference and are not part of processor package.
3.1
Package Mechanical Drawing
The package mechanical drawings are shown in 
. The drawings include 
dimensions necessary to design a thermal solution for the processor. These dimensions include:
Package reference with tolerances (total height, length, width, etc.)
IHS parallelism and tilt
Land dimensions
Top-side and back-side component keep-out dimensions
Reference datums
All drawing dimensions are in mm [in]. 
Note:
Guidelines on potential IHS flatness variation with socket load plate actuation and installation of 
the cooling solution is available in the processor Thermal/Mechanical Design Guidelines.
Figure 3-1. Processor Package Assembly Sketch
IHS
Substrate
LGA775 Socket
System Board
Capacitors
Core (die)
TIM
IHS
Substrate
LGA775 Socket
System Board
Capacitors
Core (die)
TIM