Intel 4 515/515J JM80547PE0771M User Manual

Product codes
JM80547PE0771M
Page of 96
 
Datasheet
75
Thermal Specifications and Design Considerations
5
Thermal Specifications and 
Design Considerations
5.1
Processor Thermal Specifications
The Pentium 4 processor in the 775-land package requires a thermal solution to maintain 
temperatures within operating limits as set forth in 
. Any attempt to operate the 
processor outside these operating limits may result in permanent damage to the processor and 
potentially other components within the system. As processor technology changes, thermal 
management becomes increasingly crucial when building computer systems. Maintaining the 
proper thermal environment is key to reliable, long-term system operation.
A complete thermal solution includes both component and system level thermal management 
features. Component level thermal solutions can include active or passive heatsinks attached to the 
processor Integrated Heat Spreader (IHS). Typical system level thermal solutions may consist of 
system fans combined with ducting and venting.
For more information on designing a component level thermal solution, refer to the Intel
®
 
Pentium
®
 4 Processor on 90 nm Process in the 775-Land Package Thermal Design Guidelines.
Note:
The boxed processor will ship with a component thermal solution. Refer to 
the boxed processor.
5.1.1
Thermal Specifications
To allow for the optimal operation and long-term reliability of Intel processor-based systems, the 
system/processor thermal solution should be designed such that the processor remains within the 
minimum and maximum case temperature (T
C
) specifications when operating at or below the 
Thermal Design Power (TDP) value listed per frequency in 
. Thermal solutions not 
designed to provide this level of thermal capability may affect the long-term reliability of the 
processor and system. For more details on thermal solution design, refer to the appropriate 
processor thermal design guidelines.
The Pentium 4 processor in the 775-land package introduces a new methodology for managing 
processor temperatures which is intended to support acoustic noise reduction through fan speed 
control. Selection of the appropriate fan speed will be based on the temperature reported by the 
processor’s thermal diode. If the diode temperature is greater than or equal to T
CONTROL
, the 
processor case temperature must remain at or below the temperature as specified by the thermal 
profile. If the diode temperature is less than T
CONTROL
 then the case temperature is permitted to 
exceed the thermal profile, but the diode temperature must remain at or below T
CONTROL
. Systems 
that implement fan speed control must be designed to take these conditions into account. Systems 
that do not alter the fan speed only need to guarantee the case temperature meets the thermal profile 
specifications.
To determine a processor's case temperature specification based on the thermal profile, it is 
necessary to accurately measure processor power dissipation.