Intel E5-4617 CM8062101145700 User Manual
Product codes
CM8062101145700
Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families
107
Datasheet Volume One
Thermal Management Specifications
5.1.3.2
8-Core 135W Thermal Specifications
Notes:
1.
These values are specified at V
CC_MAX
for all processor frequencies. Systems must be designed to ensure
the processor is not to be subjected to any static V
CC
and I
CC
combination wherein V
CC
exceeds V
CC_MAX
at
specified ICC. Please refer to the electrical loadline specifications in
.
2.
Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the
maximum power that the processor can dissipate. TDP is measured at maximum T
CASE
.
3.
These specifications are based on final silicon characterization.
4.
Power specifications are defined at all VIDs found in
. The processor may be delivered under
multiple VIDs for each frequency.
5.
FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor
frequency requirements.
Notes:
1.
for discrete points that constitute the thermal profile.
2.
Implementation of this Thermal Profile should result in virtually no TCC activation. Refer to the Intel®
Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Thermal/Mechanical Design Guide
for
system and environmental implementation details.
Table 5-4.
Tcase: 8-Core 135W Thermal Specifications 2U
Core
Frequency
Thermal Design
Power (W)
Minimum
T
CASE
(°C)
Maximum
T
CASE
(°C)
Notes
Launch to FMB
135
5
See
1, 2, 3, 4, 5
Figure 5-3. Tcase: 8-Core 135W Thermal Profile 2U