Intel E5-4603 BX80621E54603 User Manual

128

Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families

Datasheet Volume One

2.

Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the 

maximum power that the processor can dissipate. TDP is measured at maximum T

CASE

.

3.

These specifications are based on final silicon characterization.

4.

Power specifications are defined at all VIDs found in 

. The processor may be delivered under 

multiple VIDs for each frequency.

5.

FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor 

frequency requirements. 

1.

Please refer to 

 for discrete points that constitute the thermal profile.

2.

Implementation of this Thermal Profile should result in virtually no TCC activation. Refer to the Intel® 

for 

system and environmental implementation details.