NEC Intel Xeon E5-2430 N8101-563F User Manual

Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families

101

Datasheet Volume One

The processor requires a thermal solution to maintain temperatures within operating 

limits. Any attempt to operate the processor outside these limits may result in 

permanent damage to the processor and potentially other components within the 
system, see 

. Maintaining the proper 

thermal environment is key to reliable, long-term system operation.

A complete solution includes both component and system level thermal management 
features. Component level thermal solutions can include active or passive heatsinks 

attached to the processor integrated heat spreader (IHS). Typical system level thermal 

solutions may consist of system fans combined with ducting and venting.

This section provides data necessary for developing a complete thermal solution. For 

more information on designing a component level thermal solution, refer to the Intel® 
Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Thermal/Mechanical 
Design Guide

.

To allow optimal operation and long-term reliability of Intel processor-based systems, 

the processor must remain within the minimum and maximum case temperature 
(T

CASE

) specifications as defined by the applicable thermal profile. Thermal solutions 

not designed to provide sufficient thermal capability may affect the long-term reliability 

of the processor and system. For more details on thermal solution design, please refer 
to the Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Thermal/
Mechanical Design Guide

.

The processors implement a methodology for managing processor temperatures which 
is intended to support acoustic noise reduction through fan speed control and to assure 

processor reliability. Selection of the appropriate fan speed is based on the relative 

temperature data reported by the processor’s Platform Environment Control Interface 
(PECI) as described in 

. 

If the DTS value is less than T

CONTROL

, then the case temperature is permitted to 

exceed the Thermal Profile, but the DTS value must remain at or below TCONTROL. 

For T

CASE

 implementations, if DTS is greater than TCONTROL, then the case 

temperature must meet the T

CASE

 based Thermal Profiles. 

For DTS implementations:

• T

CASE

 thermal profile can be ignored during processor run time. 

• If DTS is greater than Tcontrol then follow DTS thermal profile specifications for fan 

speed optimization.