NEC Intel Xeon E5-2430 N8101-563F User Manual
Product codes
N8101-563F
Thermal Management Specifications
104
Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families
Datasheet Volume One
5.1.3
Processor Thermal Profiles
1.
Applies only to Intel® Xeon® Processor E5-4600 Product Family.
5.1.3.1
8-Core 150W Thermal Specifications
Notes:
1.
These values are specified at V
CC_MAX
for all processor frequencies. Systems must be designed to ensure
the processor is not to be subjected to any static V
CC
and I
CC
combination wherein V
CC
exceeds V
CC_MAX
at
specified ICC. Please refer to the electrical loadline specifications in
.
2.
Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the
maximum power that the processor can dissipate. TDP is measured at maximum T
CASE
.
3.
These specifications are based on final silicon characterization.
4.
Power specifications are defined at all VIDs found in
. The processor may be delivered under
multiple VIDs for each frequency.
5.
FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor
frequency requirements.
6.
The 150W TDP SKU is intended for the dual processor workstations only and uses workstation specific use
conditions for reliability assumptions.
Table 5-1.
Processor SKU Summary Table
TDP SKUs
Thermal Profile
Tcase
DTS
8-Core / 6-Core
150W (8-core)
135W (8-core)
130W (8-core)
130W (6-core)
130W (6-core 1S WS)
115W (8-core)
95W (8-core)
95W (6-core)
70W (8-core)
60W (6-core)
4-Core / 2-Core
130W (4-core)
130W (4-core 1S WS)
95W (4-core)
1
80W (4-core)
80W (2-core)
Table 5-2.
Tcase: 8-Core 150W Thermal Specifications, Workstation Platform SKU Only
Core
Frequency
Thermal Design
Power (W)
Minimum
T
CASE
(°C)
Maximum
T
CASE
(°C)
Notes
Launch to FMB
150
5
1, 2, 3, 4, 5, 6