NEC Intel Xeon E5-2430 N8101-563F User Manual
Product codes
N8101-563F
Thermal Management Specifications
132
Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families
Datasheet Volume One
5.1.4
Embedded Server Processor Thermal Profiles
Embedded server SKU’s target operation at higher case temperatures and/or NEBS
thermal profiles for embedded communications server form factors. The thermal
profiles in this section pertain only to those specific SKU’s. Network Equipment Building
System (NEBS) is the most common set of environmental design guidelines applied to
System (NEBS) is the most common set of environmental design guidelines applied to
telecommunications equipment in the United States.
Digital Thermal Sensor (DTS) based thermal profiles are also provided for each
Embedded server SKU. The thermal solution is expected to be developed in accordance
Embedded server SKU. The thermal solution is expected to be developed in accordance
with the Tcase thermal profile. Operational compliance monitoring of thermal
specifications and fan speed modulation may be done via the DTS based thermal
profile. The slope of a DTS profile assumes full fan speed which is not required over
profile. The slope of a DTS profile assumes full fan speed which is not required over
much of the power range. At most power levels on embedded SKU’s, temperatures of
the nominal profile are less than Tcontrol as indicated by the blue shaded region in each
DTS profile graph. As a further simplification, operation at DTS temperatures up to
DTS profile graph. As a further simplification, operation at DTS temperatures up to
Tcontrol is permitted at all power levels. Compliance to the DTS profile is required for
any temperatures exceeding Tcontrol.
5.1.4.1
8-Core LV95W Thermal Specifications
Notes:
1.
These values are specified at V
CC_MAX
for all processor frequencies. Systems must be designed to ensure
the processor is not to be subjected to any static V
CC
and I
CC
combination wherein V
CC
exceeds V
CC_MAX
at
specified ICC. Please refer to the electrical loadline specifications in
.
2.
Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the
maximum power that the processor can dissipate. TDP is measured at maximum T
CASE
.
3.
These specifications are based on final silicon characterization.
4.
Power specifications are defined at all VIDs found in
. The processor may be delivered under
multiple VIDs for each frequency.
5.
FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor
frequency requirements.
75
68.8
81.0
82.4
80
70.0
83.0
84.5
Table 5-25. 4/2-Core 80W Thermal Profile Table 1U (Sheet 2 of 2)
Power (W)
Maximum T
CASE
(°C)
Maximum DTS (°C)
4-core
4-core
2-core
Table 5-26. Embedded Server Processor Elevated Tcase SKU Summary Table
TDP SKU
Tcase Spec
DTS Spec
LV95W-8C (8-core)
LV70W-8C (8-core)
Table 5-27. Tcase: 8-Core LV95W Thermal Specifications, Embedded Server SKU
Core
Frequency
Thermal Design
Power (W)
Minimum
T
CASE
(°C)
Maximum
T
CASE
(°C)
Notes
Launch to FMB
95
5
See
1, 2, 3, 4, 5