NEC Intel Xeon E5-2407 N8101-561F User Manual
Product codes
N8101-561F
Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families
237
Datasheet Volume One
Package Mechanical Specifications
9
Package Mechanical
Specifications
The processor is packaged in a Flip-Chip Land Grid Array (FCLGA10) package that
interfaces with the baseboard via an LGA2011-0 land FCLGA10 socket. The package
consists of a processor mounted on a substrate land-carrier. An integrated heat
consists of a processor mounted on a substrate land-carrier. An integrated heat
spreader (IHS) is attached to the package substrate and core and serves as the mating
surface for processor component thermal solutions, such as a heatsink.
shows a sketch of the processor package components and how they are assembled
together. Refer to the Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product
Families Thermal/Mechanical Design Guide
Families Thermal/Mechanical Design Guide
for complete details on the LGA2011-0 land
FCLGA10 socket.
The package components shown in
1. Integrated Heat Spreader (IHS)
2. Thermal Interface Material (TIM)
3. Processor core (die)
4. Package substrate
5. Capacitors
2. Thermal Interface Material (TIM)
3. Processor core (die)
4. Package substrate
5. Capacitors
Note:
1.
Socket and baseboard are included for reference and are not part of processor package.
9.1
Package Mechanical Drawing
The package mechanical drawings are shown in
. The
drawings include dimensions necessary to design a thermal solution for the processor.
These dimensions include:
1. Package reference with tolerances (total height, length, width, and so forth)
2. IHS parallelism and tilt
3. Land dimensions
4. Top-side and back-side component keep-out dimensions
2. IHS parallelism and tilt
3. Land dimensions
4. Top-side and back-side component keep-out dimensions
Figure 9-1. Processor Package Assembly Sketch
IHS
Substrate
System Board
Capacitors
TIM
LGA2011-0 Socket
Die